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High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength
By: Ohki, Y.; Kozako, M.; Iizuka, T.; Zengbin Wang; Tanaka, T.;
2011 / IEEE / 978-1-4577-1510-5
This item was taken from the IEEE Conference ' High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength ' Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m""K and BD strength 15 kV
Sufficient Dielectric Breakdown Strength
High Breakdown Strength
Nano Filler Addition
High Thermal Conductivity Epoxy/bn Composites