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Additive photolithography based process for metal patterning using chemical reduction on surface modified polyimide
2011 / IEEE / 978-0-9568086-0-8
This item was taken from the IEEE Conference ' Additive photolithography based process for metal patterning using chemical reduction on surface modified polyimide ' This article presents progress towards the direct metallisation of polyimide via silver ion impregnation and nanocluster formation using a novel solvent free photoresist prior to electroless silver plating. Such a process is envisaged to play a major part in the fabrication of a wide range of electronic devices, such as RFID, flexible electronics, biomedical applications, OLED, e-paper and flip-chip bonding applications by providing a quicker, greener and more cost effective methods of polymer electronics production. A new method involving the chemical reduction of silver ions is presented here providing a comparison to previous UV photoreduction experiments, and a further test for electrolessly plated microstructures.
Electroless Plated Microstructures
Surface Modified Polyimide
Polyimide Direct Metallisation
Silver Ion Impregnation
Solvent Free Photoresist
Electroless Silver Plating
Flip-chip Bonding Applications
E-paper Bonding Applications
Polymer Electronics Production
Uv Photoreduction Experiments
Semiconductor Device Metallisation