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Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin
By: Wentao Zeng; Xin Miao; Deqin Si; Jingfeng Hao; Dayong Gui; Jianhong Liu;
2011 / IEEE / 978-1-4577-1769-7
Description
This item was taken from the IEEE Conference ' Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin ' Epoxy resin is widely used in electronic packaging. However, neat epoxy resin is no suitable for high-performance applications because of its poor thermal stability and toughness. Polyimide is a kind of materials with high performance for their excellent thermal stability, dimensional stability and electric property, but it is generally insoluble and infusible, and this makes it difficult to process. In this study, Amine-terminated polyesterimide (ATPEI) polymers was synthesized and used as modifier of epoxy resin. The chemical structure of ATPEI was characterized by FT-IR spectrum. The two melting peaks of differential scanning calorimetry (DSC) show ATPEI manifested liquid crystal properties, which could be verified by Polarizing microscope (POM) and X-ray diffraction (XRD) respectively. ATPEI was used to improve the thermostability, mechanical properties and especially the toughness of bisphenol A diglycidyl ether epoxy resin(ER) cured with 4,4'-Methylenedianiline (DDM). The results show that the decomposition temperature of modified materials improve about 30�C compared with that of unmodified epoxy resin. The mechanical and dynamic mechanical properties were measured by universal testing machine and DMA. The results exhibit that ATPEI modified epoxy resin has good toughness.
Related Topics
Thermodynamic Properties
Ddm
Liquid Crystal Property
Thermodynamic Property
Amine Terminated Polyesterimide
Electronic Packaging
Chemical Structure
Ftir Spectrum
Differential Scanning Calorimetry
Liquid Crystal Properties
Polarizing Microscope
X-ray Diffraction
Bisphenol A Diglycidyl Ether Epoxy Resin
4,4'-methylenedianiline
Epoxy Resins
Erbium
Temperature
Temperature Measurement
Thermal Stability
Packaging
Epoxy Resin
Polyesterimides
Synthesis
Thermomechanical Properties
Resins
Liquid Crystal Polymers
Fourier Transform Spectroscopy
Electronics Packaging
Differential Scanning Calorimetry
X-ray Diffraction
Engineering
Atpei