Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

Improving the thermal conductivity of epoxy resins with mesogenic units for electronic packaging

By: Jianhong Liu; Dayong Gui; Jingfeng Hao; Wentao Zeng;

2011 / IEEE / 978-1-4577-1769-7

Description

This item was taken from the IEEE Conference ' Improving the thermal conductivity of epoxy resins with mesogenic units for electronic packaging ' The heat dissipation is very important for electronic packaging. We have improved the thermal conductivity of electronic packaging materials by modifying epoxy resin with tetraester diepoxide monomers (TEDE). TEDE was synthesized with p-hydroxybenzoic acid, allyl bromide and glycols, and characterized by 1H-NMR. TEDE modified epoxy resin (TMEP) was cured by 4, 4'-diaminodiphenyl-methane (DDM). Thermogravimetric (TG) analysis show that the decomposition temperature of TEDE is above 280 �C, and the decomposition temperature of TMEP is above 300 �C in nitrogen atmosphere. Differential scanning calorimetry (DSC) and polarized optical microscope (POM) were employed to illustrate that TEDE is liquid crystalline polymer form room temperature to 220 �C. Dynamic mechanical analysis (DMA) illustrate that the glass transition temperature (Tg) of TMEP materials decrease with the content of TEDE increase. The thermal conductivity was measured by laser thermal conductivity testing equipment. The results show that the glass transition temperature (Tg) of 30%TEDE modified epoxy resin is above 130�C, and the thermal conductivity is 0.64w/(m�K).