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Board level validation for green IC packaging with strain-controllable dynamic bending method
2010 / IEEE / 978-1-4244-8555-0
This item was taken from the IEEE Conference ' Board level validation for green IC packaging with strain-controllable dynamic bending method ' In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.
Integrated Circuit Packaging
Scanning Electron Microscopy
Board Level Validation
Green Ic Packaging
Strain-controllable Dynamic Bending Method
Mechanical Shock Testing
Lead Free Solder Ball
Board Level Reliability
Core Material Adhesion
Polarized Optical Microscopy
Solder Joint Reliability
Thermal Aging Precondition
Strain-controllable Bending Method
X-ray Chemical Analysis
Electrical Resistance Monitoring