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Board level validation for green IC packaging with strain-controllable dynamic bending method

By: Cherie Chen; Tina Shao; Chang, G.; Chi-Ko Yu; Lee, J.C.; Brown, M.; Xiang-Kai Meng;

2010 / IEEE / 978-1-4244-8555-0

Description

This item was taken from the IEEE Conference ' Board level validation for green IC packaging with strain-controllable dynamic bending method ' In the study, instead of electrical resistance monitoring in JEDEC JESD22-B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.