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Study on the surface modification of silica particle and its filled epoxy resin
By: Dayong Gui; Jianhong Liu; Guangfu Zeng; Xin Miao; Wentao Zeng; Bo Chen;
2010 / IEEE / 978-1-4244-8142-2
This item was taken from the IEEE Conference ' Study on the surface modification of silica particle and its filled epoxy resin ' Silica particle-filled epoxy resin is widely used in electronic packaging. In this research, the isocyanate-terminated polydimethylsiloxane (ITPDMS) was synthesized by terminal-hydroxyl polydimethylsiloxane (HTPDMS) and 2, 4-toluene diisocyanate (TDI) firstly. Then the ITPDMS was used for the surface graft modification of micro-level silica. The ITPDMS modified silica (P-SiO
Filled Epoxy Resin
Surface Graft Modification
Silane Coupling Agent
Universal Testing Machine
Dynamic Mechanical Analysis
Scanning Electron Microscopy
Glass Transition Temperature