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Study on the surface modification of silica particle and its filled epoxy resin
By: Dayong Gui; Jianhong Liu; Guangfu Zeng; Xin Miao; Wentao Zeng; Bo Chen;
2010 / IEEE / 978-1-4244-8142-2
Description
This item was taken from the IEEE Conference ' Study on the surface modification of silica particle and its filled epoxy resin ' Silica particle-filled epoxy resin is widely used in electronic packaging. In this research, the isocyanate-terminated polydimethylsiloxane (ITPDMS) was synthesized by terminal-hydroxyl polydimethylsiloxane (HTPDMS) and 2, 4-toluene diisocyanate (TDI) firstly. Then the ITPDMS was used for the surface graft modification of micro-level silica. The ITPDMS modified silica (P-SiO
Related Topics
Silica Particle
Filled Epoxy Resin
Electronic Packaging
Isocyanate-terminated Polydimethylsiloxane
Surface Graft Modification
Micro-level Silica
Interfacial Bonding
Silane Coupling Agent
Universal Testing Machine
Dynamic Mechanical Analysis
Scanning Electron Microscopy
Tensile Strength
Bending Strength
Glass Transition Temperature
Erbium
Silicon Compounds
Surface Morphology
Thermal Stability
Epoxy Resins
Surface Cracks
Surface Modification
Sio2
Resins
Electronics Packaging
Bending Strength
Tensile Strength
Engineering
Terminal-hydroxyl Polydimethylsiloxane