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A core-shell structure viscoelastic model of particulate-filled electronic packaging polymers
By: Xin Miao; Bo Chen; Jianhong Liu; Dayong Gui; Deyu Tian; Guangfu Zeng;
2009 / IEEE / 978-1-4244-4658-2
This item was taken from the IEEE Conference ' A core-shell structure viscoelastic model of particulate-filled electronic packaging polymers ' On the basis of structural and mechanical characterization of particulate-filled epoxy materials, a new core-shell structure viscoelastic constitutive model is established for predicting mechanical performances of particulate-filled electronic packaging materials in this paper. The three-phases(layers) of core-shell particle and matrix constitute the core-shell structure model and the modified Kelvin viscoelastic model was combined with the structure model, which improve the mechanical property's calculation of electronic packaging polymers. With this model, the relationship between mechanical properties of the electronic packaging materials and modulus of matrix, solid particles content, particle size, gradation and modulus of the intermediate shell layer were constructed mathematically and analytical modeling of tensile strength and elongation of particle-filled electronic packaging polymers was conducted. The results show that the predictions of this model is in good agreement with experimental measurements for both tensile strength and elongation of particulate-filled electronic packaging materials.
Viscoelastic Constitutive Model
Particulate-filled Epoxy Materials
Modified Kelvin Viscoelastic Model
Solid Particle Content
Intermediate Shell Layer Modulus
Particulate-filled Electronic Packaging Polymers