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A compact thermal-via packaging design of GaInP/GaAs collector-up HBTs in small high-power amplifiers

By: Lee, P.H.; Tseng, H.C.; Chou, J.H.;

2008 / IEEE / 978-1-4244-2258-6

Description

This item was taken from the IEEE Conference ' A compact thermal-via packaging design of GaInP/GaAs collector-up HBTs in small high-power amplifiers ' We model the thermal performance of the large thermal via which under the collector-up heterojunction bipolar transistor (HBT) by using a finite element method. A compact thermal-via packaging of GaInP/GaAs collector-up HBTs has been designed and calculated. The results indicate that the configuration can be further reduced by 29% to meet the requirement of small high-power amplifiers for cellular-phone communication systems.