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Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances
By: Fuller, N.; Ouyang, C.; Xinlin Wang; Huiming Bu; Joseph, E.; Huang, E.; Shahidi, G.; Purushothaman, S.; Chun-Yung Sung; Haensch, W.; Sunfei Fang; Lauer, I.; Mallikarjunan, A.; Tien Cheng; Shobha, H.; Simonyi, E.;
2008 / IEEE / 978-1-4244-1954-8
This item was taken from the IEEE Conference ' Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances ' Integration of low-dielectric constant SiCOH dielectrics (k<3) adjacent to gate stacks is demonstrated using 65 nm technology. Substantial reductions in parasitic capacitances are achieved through reductions in the outer fringe component of the overlap capacitance and the capacitance between the gate stack and metal contacts. These results are consistent with modeling. Although this is demonstrated with 65 nm devices, low-k spacers can cut active power consumption and have the potential to improve performance through reductions in parasitic capacitances which will be of greater importance for future technology nodes.
Research And Development
Power Cmos Devices
Power Semiconductor Devices
Low-k Dielectric Thin Films
Cmos Integrated Circuits