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Miniaturization design of backside-via structures underneath collector-Up HBTs using A 3-D finite-element model

By: Chou, J.H.; Lee, P.H.; Tseng, H.C.;

2008 / IEEE / 978-1-4244-2739-0

Description

This item was taken from the IEEE Conference ' Miniaturization design of backside-via structures underneath collector-Up HBTs using A 3-D finite-element model ' To carry out the miniaturization design of backside-via packaging structures underneath collector-up HBTs, a 3-D finite-element model has been developed for analyzing temperature-distribution phenomena within the configurations. The results are demonstrated on the three-finger InGaP/GaAs collector-up HBT. Compared to previous reports, backside-via structures can be further reduced by 42% while maintaining the same heat-dissipation performance.