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A reliability-aware RF power amplifier design for CMOS radio chip integration

By: Goltman, G.; Fridman, A.; Tendler, A.; Wail, S.; Degani, O.; Ruberto, M.;

2008 / IEEE / 978-1-4244-2049-0

Description

This item was taken from the IEEE Conference ' A reliability-aware RF power amplifier design for CMOS radio chip integration ' For significant cost reduction in Wi-Fi platforms, the power amplifier must be integrated into the CMOS radio RFIC. This paper surveys how this most challenging circuit was carefully engineered to mitigate aging effects, ESD, and thermal issues for deployment into our product platforms. Experimental results are also presented here.