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Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages
By: Paghasian, K.Y.; Kanth, K.R.; Tan Hian Boon; Tanary, S.; Toh, C.H.; Retuta, D.;
2007 / IEEE / 978-1-4244-1324-9
Description
This item was taken from the IEEE Conference ' Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages ' This Paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results
Related Topics
Integrated Circuit Design
Integrated Circuit Interconnections
System-in-package
Vacuum Chase
Flip Chips Packages
Tooling Strategies
Transfer Moldable Under-fill Mold Compounds
System In Package
Stacked Die Fbga Packages
Ir Shields
Critical Mold Parameters
Design Optimization
Flip Chip
Costs
Electronics Packaging
Vacuum Systems
Strips
Laminates
System Testing
Assembly Systems
Qualifications
Flip-chip Devices
Fine-pitch Technology
Electromagnetic Shielding
Chip Scale Packaging
Ball Grid Arrays
Transfer Moulding
Engineering
Effective Parameter Optimization
