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Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages

By: Paghasian, K.Y.; Kanth, K.R.; Tan Hian Boon; Tanary, S.; Toh, C.H.; Retuta, D.;

2007 / IEEE / 978-1-4244-1324-9

Description

This item was taken from the IEEE Conference ' Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages ' This Paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results