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Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages
2007 / IEEE / 978-1-4244-1324-9
This item was taken from the IEEE Conference ' Better Tooling Design and Effective Parameter Optimization for Successful transfer MUF of Flip Chips packages ' This Paper show cases various tooling strategies that can be taken up in building a vacuum chase for moldable under-fill (MUF) of flip chip packages, (SIP) system in package and molding other advanced stacked die packages. Various MUF mold compounds are evaluated, which have shown good MSL#3 results. The tooling developed is successfully used in the qualification MUF flip chip packages, stacked die FBGA packages and SIP with IR shields. Finally the paper discusses critical mold parameters, their effect on MUF molding and MSL#3 results
Integrated Circuit Design
Integrated Circuit Interconnections
Flip Chips Packages
Transfer Moldable Under-fill Mold Compounds
System In Package
Stacked Die Fbga Packages
Critical Mold Parameters
Chip Scale Packaging
Ball Grid Arrays
Effective Parameter Optimization