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Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows
By: Chen, T.D.; Tu, C.T.; Hao Liu; Toh, C.H.; Yeo, J.;
2007 / IEEE / 978-1-4244-1391-1
This item was taken from the IEEE Conference ' Interfacial Reactions in Ni-doped SAC105 and SAC405 Solders on Ni-Au Finish during Multiple Reflows ' Solder-joint performances for SAC405, SAC105 with 200ppm Ni and SAC105 with 500ppm Ni were reviewed for electrolytic Ni-Au BGA pad finish. For each alloy system, ball shear tests, cross-sectional analysis and 3-D etching were performed to study the interfacial reactions after repeated reflows. Also, the effect of solder-mask pad design on solder joint integrity was investigated. In this study, all three systems gave rise to only (Cu,Ni)
Electrolytic Bga Pad Finish
Solder-mask Pad Design
(cu,ni)6sn5 - System
Temperature 245 C
Ball Grid Arrays
Ball Shear Tests