Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

Substrate effects on the creep properties of pure Sn solder joints

By: Kyu-Oh Lee; Hua, F.; Morris, J.W., Jr.;

2005 / IEEE / 0-7803-9085-7

Description

This item was taken from the IEEE Conference ' Substrate effects on the creep properties of pure Sn solder joints ' This study investigated the influence of substrate metallization on the microstructure and creep behavior of the pure tin solder joints. Both symmetric (Cu:Cu) and the asymmetric (Cu:Au/Ni) metallizations were tested. The solder joints with asymmetric substrates had lower creep rates than those with symmetric (Cu:Cu) substrates. (Cu-Ni)/sup 6/Sn/sup 5/ intermetallics formed on all substrates. However, a dramatic and anomalous intermetallic growth was observed on the Ni-side of the asymmetric joints; after typical reflow the intermetallic reached almost one third of the solder joint thickness. It appears that the abnormally thick intermetallic inhibits creep in the asymmetric joint and is the primary cause of the lower creep rates.