Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

Development and test of TAB bonded micro-cables for silicon detectors in a Compton prostate probe

By: Borshchov, V.; Rogers, W.L.; Bernabeu, J.; Lacasta, C.; Zontar, D.; Zinovjev, G.; Zhang, L.; Weilhammer, P.; Studen, A.; Starkov, V.; Burdette, D.; Protsenko, M.; Modesto, P.; Mikuz, M.; Llosa, G.; Listratenko, A.; Kagan, H.; Honscheid, K.; Dewaraja, Y.K.; Clinthorne, N.H.; Chesi, E.;

2005 / IEEE / 0-7803-9221-3

Description

This item was taken from the IEEE Conference ' Development and test of TAB bonded micro-cables for silicon detectors in a Compton prostate probe ' This contribution describes the work made towards packaging optimization in the frame of the development of an endorectal probe for imaging the prostate. This application is based on the concept of electronic collimation for single gamma detection taking advantage of the Compton scattering of the photons in a stack of 1 mm thick silicon pad detectors and their later absorption in an external detector. This concept allows to remove the mechanical collimators used in the usual gamma cameras and, therefore, provides the possibility of improving both sensitivity and resolution. Packaging of the silicon sensors and their associated electronics is of paramount importance in this application. To address this important aspect of the device we have explored the tape automated bonding (TAB) technique for the connection of the silicon sensors to the readout electronics and for routing the signals to the outside. TAB offers an elegant solution not only for a flexible and compact interconnection between the readout ASICs and the sensors but also for ASIC selection and testing prior to the assembly of the detector and their associated readout electronics.