Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

A novel integrated packaging technique for high density DC-DC converters providing enhanced efficiency and thermal management

By: Wanes, J.;

2004 / IEEE / 0-7803-8269-2

Description

This item was taken from the IEEE Conference ' A novel integrated packaging technique for high density DC-DC converters providing enhanced efficiency and thermal management ' As current requirements of microprocessors and ASIC's increase, traditional packaging techniques limit the electrical and thermal performance of DC-DC converters designed to supply these low voltage, high current loads. This paper describes a novel integrated packaging technique that uses a copper lead-frame in the high current path to reduce the electrical and thermal resistance of the DC-DC converter. The lead-frame is used to integrate the single turn secondary windings of the power transformer and the output choke. This integrated structure also serves as the high current interconnect to the motherboard, and a heat-sink for the secondary synchronous rectifiers. A 1.8 V 100 A industry standard half brick is used to demonstrate the performance advantages of the new technique.