Your Search Results

Use this resource - and many more! - in your textbook!

AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.

Experience the freedom of customizing your course pack with AcademicPub!
Not an educator but still interested in using this content? No problem! Visit our provider's page to contact the publisher and get permission directly.

Chemical mechanical polishing of aluminum for the 0.18 /spl mu/m dual damascene process

By: Webster, M.N.; Lifka, H.; Mutsaers, C.A.H.; Kordic, S.;

1998 / IEEE / 0-7803-4285-2

Description

This item was taken from the IEEE Conference ' Chemical mechanical polishing of aluminum for the 0.18 /spl mu/m dual damascene process ' Chemical mechanical polishing of aluminum is used for the 0.18 /spl mu/m aluminum dual damascene process. Issues concerning the choice of slurry are discussed. Initial results show a yield of 80% on 3.15 m long and 0.4 /spl mu/m wide damascene lines. Comb structures have no shorts. At the same time, no Al line dishing was observed. The end-point-detection system on the Applied Materials MIRRA CMP tool is discussed.