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Multilayer Broadside-Coupled Dispersive Delay Structures for Analog Signal Processing
By: Horii, Y.; Caloz, C.; Nikfal, B.; Gupta, S.;
2012 / IEEE
This item was taken from the IEEE Periodical ' Multilayer Broadside-Coupled Dispersive Delay Structures for Analog Signal Processing ' A compact multilayer non-commensurate C-section dispersive delay structure (DDS) is proposed for analog signal processing (ASP) applications. In contrast to a previously reported C-section DDS, which was uniplanar and used edge-coupled C-sections, this DDS is based on broadside-coupled C-sections, and hence achieves a much larger ratio of group delay swing to frequency bandwidth, leading to higher ASP resolution. Moreover, it is much more compact, while maintaining acceptable insertion loss. After a parametric characterization of a mono-block commensurate multilayer DDS, with varied strip widths, two multiblock non-commensurate DDSs with linear group delay slopes are demonstrated by full-wave simulation and experimental low-temperature co-fired ceramics results. The proposed DDS exhibits a significant footprint reduction factor of around 7 compared to its uniplanar edge-coupled counterpart.
Multilayer Broadside-coupled Dispersive Delay Structure
Compact Multilayer Noncommensurate C-section Dispersive Delay Structure
Analog Signal Processing
Multiblock Noncommensurate Dds
Linear Group Delay Slope
Low-temperature Co-fired Ceramics (ltcc) Technology
Analog Signal Processing (asp)
Dispersive Delay Structures (ddss)
Group Delay Engineering
Footprint Reduction Factor
Analogue Processing Circuits
Fields, Waves And Electromagnetics
Group Delay Swing