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Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI
2012 / IEEE
This item was taken from the IEEE Periodical ' Through-Silicon Photonic Via and Unidirectional Coupler for High-Speed Data Transmission in Optoelectronic Three-Dimensional LSI ' We develop Si-core through-silicon photonic via (TSPV) and unidirectional coupler for low-loss and high-speed data transmission in an optoelectronic 3-D LSI. The TSPVs, comprising a Si-core and SiO2 cladding, were fabricated simultaneously with Cu TSVs. The characteristics of light confinement of the TSPV were measured using a near-field pattern measurement. The spot light area was well confined within the TSPV without interference from the lights. The optical intensity that passed through the TSPV was 20% higher than that which passed through the Si substrate. The unidirectional optical coupler with two mirrors showed higher coupling efficiency. Laser light can be efficiently propagated to a planar Si waveguide through the TSPV and the unidirectional coupler.
Through-silicon Photonic Via
Optoelectronic Three-dimensional Lsi
Near-field Pattern Measurement
Spot Light Area Was
Unidirectional Optical Coupler
High Speed Optical Techniques
Large Scale Integration
Through-silicon Photonic Via (tspv)
Near-field Pattern (nfp)
Optoelectronic 3-d Lsi
Components, Circuits, Devices And Systems
Engineered Materials, Dielectrics And Plasmas
High-speed Data Transmission