Use this resource - and many more! - in your textbook!
AcademicPub holds over eight million pieces of educational content for you to mix-and-match your way.
3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link
By: Okuma, Y.; Osada, K.; Saen, M.; Hattori, T.; Kuroda, T.; Hasegawa, A.; Niitsu, K.; Irie, N.; Nonomura, I.; Kasuga, K.; Kohama, Y.; Sugimori, Y.; Shimazaki, Y.;
2010 / IEEE
This item was taken from the IEEE Periodical ' 3-D System Integration of Processor and Multi-Stacked SRAMs Using Inductive-Coupling Link ' This paper describes a three-dimensional (3-D) system integration of a full-fledged processor chip and two memory chips using inductive coupling. To attain a 3-D communication link with a smaller area and lower power-consumption, shortening the link distance and preventing signal degradation due to unused inductors are important challenges. Therefore, we developed a new 3D-integrated wire-penetrated multi-layer structure for a shorter link distance and an open-skipped-inductor scheme for suppressing signal degradation. In addition, to avoid undefined-value propagation in stacking multi-memories using an inductive-coupling link, we proposed a memory-access-control scheme with a pinpoint-data-capture scheme. We demonstrate that three fabricated chips can be successfully AC-coupled using inductive coupling. The power and area efficiency of the link are 1 pj/b and 0.15 mm2 /Gbps, respectively, which are the same as those of two-chip integration.
Chip Scale Packaging
Three-dimensional System Integration
Components, Circuits, Devices And Systems
Engineered Materials, Dielectrics And Plasmas
3d Communication Link
3d System Integration