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Dual work function metal gates using full nickel silicidation of doped poly-Si
By: Sim, J.H.; Kwong, D.L.; Lu, J.P.; Wen, H.C.;
2003 / IEEE
This item was taken from the IEEE Periodical ' Dual work function metal gates using full nickel silicidation of doped poly-Si ' This paper investigates the work function adjustment on fully silicided (FUSI) NiSi metal gates for dual-gate CMOS, and how it is effected by the poly-Si dopants. By comparing FUSI on As-, B-, and undoped poly-Si using the same p-Si substrates, it is shown that both As and B influence the work function of NiSi FUSI gate significantly, with As showing more effects than B possibly due to more As pile-up at the NiSi-SiO/sub 2/ interface. No degradations on the underlying gate dielectrics are observed in terms of interface state density (D/sub it/), fixed oxide charges, leakage current, and breakdown voltage, suggesting that NiSi FUSI is compatible with dual-gate CMOS processing.
Integrated Circuit Metallisation
Dual Work Function Metal Gates
Work Function Adjustment
Nisi-sio/sub 2/ Interface
Interface State Density
Fixed Oxide Charges
Cmos Integrated Circuits
Semiconductor Device Breakdown
Components, Circuits, Devices And Systems
Engineered Materials, Dielectrics And Plasmas
Fully Silicided Nisi Metal Gates