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Application of system-level EM modeling to high-speed digital IC packages and PCBs
By: Sakallah, K.A.; Katehi, L.P.B.; Jong-Gwan Yook; Schreyer, T.A.; Huang, L.; Martin, R.S.;
1997 / IEEE
Description
This item was taken from the IEEE Periodical ' Application of system-level EM modeling to high-speed digital IC packages and PCBs ' A system-level electromagnetic (EM) modeling tool combining a three-dimensional (3-D) full-wave finite-element EM-field analysis tool and a time-domain electric-circuit simulator is developed and applied to various geometries such as multilayer printed circuit boards (PCBs), signal lines embedded in a PCB or package, and split power-distribution network. Since the signal integrity is a primary concern of high-speed digital circuits, the noise distributions on various circuit planes are evaluated from the analysis. These noise distributions, often called voice maps, are utilized to identify the location of the major source of simultaneous switching noise (SSN). This information can eventually be adapted for optimum placement of decoupling capacitors to minimize the noise fluctuations on the various circuit planes on an entire PCB.
Related Topics
Integrated Circuit Modelling
Integrated Circuit Noise
Decoupling Capacitor
High-speed Digital Ic Package
System-level Electromagnetic Model
Time-domain Electric-circuit Simulator
Multilayer Printed Circuit Board
Signal Line
Split Power-distribution Network
Noise Distribution
Voice Map
Simultaneous Switching Noise
Integrated Circuit Modeling
Application Specific Integrated Circuits
High Speed Integrated Circuits
Digital Integrated Circuits
Circuit Noise
Solid Modeling
Power System Modeling
Electromagnetic Modeling
Signal Analysis
Finite Element Methods
Finite Element Analysis
Printed Circuits
Integrated Circuit Packaging
Digital Integrated Circuits
Circuit Analysis Computing
Fields, Waves And Electromagnetics
Engineering
Three-dimensional Full-wave Finite-element Em-field Analysis