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Stress, microstructure and materials reliability of sputter-deposited Fe-N films

By: Kim, Y.K.; Narayan, P.B.;

1994 / IEEE

Description

This item was taken from the IEEE Periodical ' Stress, microstructure and materials reliability of sputter-deposited Fe-N films ' Sputtered Fe-N films with various nitrogen contents were investigated from point of view of device manufacturing. As-deposited Fe-N films have compressive stress that becomes tensile due to heat treatment. At optimum N content where soft magnetic properties were realized, the film shows a close to amorphous microstructure. Compared to NiFe, Fe-N has higher reactivity with humidity and lower reactivity with atmospheric pollutants such as Cl and S.<>