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High-power high-speed silicon transistor

By: Walczak, D.A.; Kannam, P.J.; Chu, T.L.;

1967 / IEEE


This item was taken from the IEEE Periodical ' High-power high-speed silicon transistor ' High-power high-speed silicon transistors were fabricated on a single wafer using a double-epitaxial single-diffused technique. An N-collector region was deposited on an N+substrate material. The base region was also formed epitaxially by depositing, in situ, a P+layer on the top of the collector region; and the emitter region was formed by diffusion. The transistors were found to have a collector current (Ic) capability of 150 A with a total switching time of 2 �s.