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Author: Wilson, P.L.O.
Multi chip stacking & reliability challenges using TSV-micro C4 solder interconnection for FCCSP TSV package2011 / IEEE / 978-1-4577-1982-0
By: Au, K.Y.; Beleran, J.D.; Yang, Y.B.; Zhang, Y.F.; Kriangsak, S.L.; Wilson, P.L.O.; Drake, Y.S.K.; Nathapong, S.;
Thru silicon via stacking & numerical characterization for multi-die interconnections using full array & very fine pitch micro C4 bumps2011 / IEEE / 978-1-61284-498-5
By: Kriangsak, S.L.; Beleran, J.D.; Zhang, Y.F.; Yang, Y.B.; Wilson, P.L.O.; Au, K.Y.; Surasit, C.; Toh, C.H.; Drake, Y.S.K.;