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Author: Steinmann, P.

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Effect of intermetallic formation on electromigration reliability of TSV-microbump joints in 3D interconnect
2012 / IEEE / 978-1-4673-1965-2
By: Seung-Hyun Chae; Yiwei Wang; Ho, P.S.; Im, J.; Tengfei Jiang; Bonifield, T.; Steinmann, P.; Mawatari, K.; Takahashi, Y.; Dunne, R.;
Development of a stacked WCSP package platform using TSV (Through Silicon Via) technology
2012 / IEEE / 978-1-4673-1965-2
By: Bonifield, T.; Matsuura, M.; Mawatari, K.; Takahashi, Y.; Dunne, R.; Stepniak, D.; Steinmann, P.;
Modeling the Negative Quadratic VCC of $\hbox{SiO}_{2}$ in MIM Capacitor
2011 / IEEE
By: Steinmann, P.; Thanh Hoa Phung; Chunxiang Zhu; Yee-Chia Yeo; Wise, R.;
Asymmetric quantum wells with enhanced QCSE: modulation behaviour and application for integrated laser/modulator
1997 / IEEE
By: Steinmann, P.; Stegmuller, B.; Borchert, B.;
Improved monolithic laser/modulator behaviours by a modified identical active layer structure
1997 / IEEE / 0-7803-3895-2
By: Steinmann, P.; Stegmuller, B.; Borchert, B.;
Improved behavior of monolithically integrated laser/modulator by modified identical active layer structure
1997 / IEEE
By: Borchert, B.; Steinmann, P.; Stegmuller, B.;
Analog characteristics of metal-insulator-metal capacitors using PECVD nitride dielectrics
2001 / IEEE
By: Dirnecker, C.; Pinto, A.; Balster, S.G.; Babcock, J.A.; El-Kareh, B.; Jumpertz, R.; Steinmann, P.;
A 5V complementary-SiGe BiCMOS technology for high-speed precision analog circuits
2003 / IEEE / 0-7803-7800-8
By: Willis, C.; Weijtmans, J.W.; Waitschull, M.; Tatman, D.; Swanson, L.; Schulz, U.; Schober, M.; Schiekofer, M.; Scharnagl, T.; Ramin, M.; Menz, P.; Haeusler, A.; Foglietti, P.; Dirnecker, C.; Dawoodi, K.; Corsi, M.; Yasuda, H.; Steinmann, P.; Leitz, W.; Balster, S.; El-Kareh, B.;
Controlling the TCR of thin film resistors
2000 / IEEE / 2-86332-248-6
By: Higgins, R.; Jacobsen, S.M.; Steinmann, P.;
BiCom3HV - A 36V Complementary SiGe Bipolar- and JFET-Technology
2007 / IEEE / 978-1-4244-1018-7
By: Yasuda, H.; Schwartz, W.; Parsons, S.; Hannaman, D.; Meinel, W.; Boyd, W.; Steinmann, P.;
The Effects of Proton and X-Ray Irradiation on the DC and AC Performance of Complementary (npn + pnp) SiGe HBTs on Thick-Film SOI
2007 / IEEE
By: Bellini, M.; Yasuda, H.; Steinmann, P.; Balster, S.; El-Kareh, B.; Fleetwood, D.M.; Schrimpf, R.D.; Marshall, P.W.; Cressler, J.D.; Peng Cheng; Appaswamy, A.C.; Sutton, A.K.; Bongim Jun;
Mismatch characterization of a high precision resistor array test structure
2008 / IEEE / 978-1-4244-1800-8
By: Weidong Tian; Madhani, P.; Khan, I.; Beach, E.; Steinmann, P.;
Visualization of Particle Interactions in Granular Media
2008 / IEEE
By: Hagen, H.; Kerren, A.; Wagner, C.; Schlemmer, M.; Meier, H.A.; Steinmann, P.; Kuhl, E.;
Effective Modulation of Quadratic Voltage Coefficient of Capacitance in MIM Capacitors Using $\hbox{Sm}_{2}\hbox{O}_{3}/\hbox{SiO}_{2}$ Dielectric Stack
2009 / IEEE
By: Yee-Chia Yeo; Ming-Bin Yu; Ming-Fu Li; Dim-Lee Kwong; Chunxiang Zhu; Steinmann, P.; Wise, R.; Jing-De Chen; Jian-Jun Yang;
Performance Improvement of $\hbox{Sm}_{2}\hbox{O}_{3}$ MIM Capacitors by Using Plasma Treatment After Dielectric Formation
2009 / IEEE
By: Wise, R.; Jing-De Chen; Jian-Jun Yang; Chunxiang Zhu; Yee-Chia Yeo; Steinmann, P.;
Simple Analytical Model of the Thermal Resistance of Resistors in Integrated Circuits
2010 / IEEE
By: Chatterjee, A.; Meinel, W.; Beach, E.; Steinmann, P.; Weidong Tian; Bucksch, R.V.; Weiser, D.;

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