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Author: Shobha, H.

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In Situ Co/SiC(N,H) Capping Layers for Cu/Low- k Interconnects
2012 / IEEE
By: Grill, A.; Nguyen, S.; Shobha, H.; Li, B.; Ye, W.; Edelstein, D.; Yang, C.-C.; Shek, M.; AuBuchon, J.;
In-situ metal/dielectric capping process for electromigration enhancement in Cu interconnects
2012 / IEEE / 978-1-4673-1137-3
By: Chen, F.; Yang, C.; Edelstein, D.; Shek, M.; AuBuchon, J.; Ye, W.; Grill, A.; Nguyen, S.; Shobha, H.; Li, B.;
Robust low-k film with sub-nm pores and high carbon content for highly reliable Cu/low-k BEOL modules
2012 / IEEE / 978-1-4673-1137-3
By: Inoue, N.; Tagami, M.; Yamamoto, H.; Kawahara, J.; Soda, E.; Shobha, H.; Gates, S.; Cohen, S.; Liniger, E.; Madan, A.; Protzman, J.; Ryan, E.T.; Ryan, V.; Ueki, M.; Hayashi, Y.; Spooner, T.; Ito, F.;
56 nm pitch copper dual-damascene interconnects with triple pitch split metal and double pitch split via
2012 / IEEE / 978-1-4673-1137-3
By: Chen, J.H.-C.; Waskiewicz, C.; Spooner, T.; Clevenger, L.; Colburn, M.; Arnold, J.C.; Haran, B.; Liemann, L.; Huang, E.; Choi, S.; Demarest, J.; Juntao Li; Levin, T.; Boye, C.; Mclellan, E.; Canaperi, D.; Kelly, J.J.; van der Straten, O.; Sankarapandian, M.; Shobha, H.; Mignot, S.; Fan, S.S.-C.; Halle, S.; Chiew-seng Koay; Yongan Xu; Saulnier, N.; Chia-Hsun Tseng; Yunpeng Yin; Mignot, Y.; Beard, M.; Morris, B.; Horak, D.;
56nm-pitch low-k/Cu dual-damascene interconnects integration with sidewall image transfer (SIT) patterning scheme
2012 / IEEE / 978-1-4673-1137-3
By: Usui, T.; Colburn, M.; Spooner, T.; Arnold, J.C.; Saulnier, N.; Soda, E.; Shobha, H.; Chen, S.-T.; Waskiewicz, C.; Ishikawa, M.; Yin, Y.; Shimada, K.; Tagami, M.;
Performance of ultrathin alternative diffusion barrier metals for next - Generation BEOL technologies, and their effects on reliability
2014 / IEEE
By: Nogami, T.; Chae, M.; Edelstein, D.; Spooner, T.; Huang, E.; Bonilla, G.; Motoyama, K.; Simon, A.; Straten, O.; Penny, C.; Shaw, T.; Shobha, H.; Li, J.; Cohen, S.; Hu, C-K.; Zhang, X.; He, M.; Tanwar, K.; Patlolla, R.; Chen, S-T.; Kelly, J.; Lin, X.;
Advanced metal and dielectric barrier cap films for Cu low k interconnects
2014 / IEEE
By: Priyadarshini, Deepika; Nguyen, S.; Shah, K.; Ren, J.; Stolfi, M.; Balseanu, M.; Collins, D.; Edelstein, D.; Canaperi, D.; Grill, A.; Shobha, H.; Cohen, S.; Shaw, T.; Liniger, E.; Hu, C.K.; Parks, C.; Adams, E.; Burnham, J.; Simon, A.H.; Bonilla, G.;
65nm Cu Integration and Interconnect Reliability in Low Stress K=2.75 SiCOH
2006 / IEEE / 1-4244-0104-6
By: McGahay, V.; Bonilla, G.; Chen, F.; Christiansen, C.; Cohen, S.; Cullinan-Scholl, M.; Demarest, J.; Dunn, D.; Engel, B.; Fitzsimmons, J.; Gill, J.; Grunow, S.; Herbst, B.; Hichri, H.; Ida, K.; Klymko, N.; Kiene, M.; Labelle, C.; Lee, T.; Liniger, E.; Liu, X.H.; Madan, A.; Malone, K.; Martin, J.; McLaughlin, P.V.; Minami, P.; Molis, S.; Muzzy, C.; Nguyen, S.; Patel, J.C.; Restaino, D.; Sakamoto, A.; Shaw, T.M.; Shimooka, Y.; Shobha, H.; Simonyi, E.; Widodo, J.; Grill, A.; Hannon, R.; Lane, M.; Nye, H.; Spooner, T.; Wisnieff, R.; Ivers, T.;
Low-k spacers for advanced low power CMOS devices with reduced parasitic capacitances
2008 / IEEE / 978-1-4244-1954-8
By: Fuller, N.; Ouyang, C.; Xinlin Wang; Huiming Bu; Joseph, E.; Huang, E.; Shahidi, G.; Purushothaman, S.; Chun-Yung Sung; Haensch, W.; Sunfei Fang; Lauer, I.; Mallikarjunan, A.; Tien Cheng; Shobha, H.; Simonyi, E.;
A BEOL multilevel structure with ultra low-k materials (k d 2.4)
2010 / IEEE / 978-1-4244-7678-7
By: Lee, T.C.; Chanda, K.; Filippi, R.; Gill, J.; Engbrecht, E.; Lustig, N.; Bao, J.; Shobha, H.; Nguyen, S.; Grill, A.; Gates, S.M.; Zielinski, E.; Tseng, W.; Choi, J.; Flaitz, P.; Simon, A.; Law, S.B.; Cheng, T.; Lisi, A.; Kioussis, D.;
64 nm pitch Cu dual-damascene interconnects using pitch split double exposure patterning scheme
2011 / IEEE / 978-1-4577-0502-1
By: Shyng-Tsong Chen; Tomizawa, H.; Spooner, T.; Usui, T.; Colburn, M.; Arnold, J.C.; Mclellan, E.; Scaduto, A.; Xu, Y.; Landie, G.; Kato, H.; Halle, S.; Burns, S.; Koay, C.-S.; Mignot, Y.; Ishikawa, M.; Horak, D.; Yin, Y.; Cohen, S.; Levin, T.; Canaperi, D.; Kelly, J.; Van der Straten, O.; Tsumura, K.; Tagami, M.; Shobha, H.; Sankarapandian, M.;
Improvement of RC performance for advanced ULK/Cu interconnects with CVD hybrid dielectric/metal liner
2011 / IEEE / 978-1-4577-0502-1
By: Shobha, H.; Yang, C.; Tagami, M.; Spooner, T.; Ito, F.; Cohen, S.; Soda, E.; Molis, S.; Parks, C.; Davis, R.; Murphy, R.; DeHaven, P.; Madan, A.;
Optimization of porous ultra low-� dielectrics (� d 2.55) for 28nm generation
2011 / IEEE / 978-1-4577-0502-1
By: Kioussis, D.; Ryan, E.T.; Virwani, K.; Cohen, S.; Osborne, G.; Daubenspeck, T.; Bonilla, G.; Shaw, T.; Sundlof, B.; Shobha, H.; Grill, A.; Gates, S.M.; Child, C.; Augur, R.; Quon, R.; Clevenger, L.; Restaino, D.; Lee, T.; Liang, S.; Masuda, H.; Sun, Z.; Madan, A.; Klymko, N.; Molis, S.;
Robust self-aligned via process for 64nm pitch Dual-Damascene interconnects using pitch split double exposure patterning scheme
2011 / IEEE / 978-1-4577-0502-1
By: Tomizawa, H.; Chen, S.T.; Spooner, T.; Usui, T.; Colburn, M.; Arnold, J.; Vo, T.; Maniscalco, J.; van der Straten, O.; Sankarapandian, M.; Shobha, H.; Tagami, M.; Tsumura, K.; Burns, S.; Landie, G.; Koay, C.S.; Kelly, J.; Ishikawa, M.; Yin, Y.; Kato, H.; Horak, D.;

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