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Author: Rongwei Zhang

Results

Learning sparse Fuzzy Cognitive Maps by Ant Colony Optimization
2013 / IEEE
By: Zhengyan Wu; Jun Lu; Xianhua He; Dehong Wang; Rongwei Zhang; Ming Gao; Nan Ye; Qi Zheng;
Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles
2010 / RSC Publishing
By: C. P. Wong; Wei Lin; Kyoungsik Moon; Rongwei Zhang;
Selective Recognition of Bile Acids by Molecular Imprints
2007 / IEEE / 978-1-4244-1261-7
By: Mizaikoff, B.; Shuting Wei; Rongwei Zhang;
Electrically conductive adhesive with �-conjugated self-assembled molecular wire junctions for enhanced electrical and thermal properties
2008 / IEEE / 978-1-4244-2230-2
By: Rongwei Zhang; Wong, C.P.; Daoqiang Daniel Lu; Kyoung Sik Moon; Myung Jin Yim; Yi Li;
In-situ reduced silver nanoparticles for highly conductive anisotropic conductive films applications
2008 / IEEE / 978-1-4244-2141-1
By: Hongjin Jiang; Wong, C.P.; Rongwei Zhang; Kyoung-sik Moon;
Development of transparent and flexible electrically conductive adhesives for microelectronics applications
2008 / IEEE / 978-1-4244-2141-1
By: Kyoung-sik Moon; Wei Wang; Rongwei Zhang; Wong, C.P.; Wei Lin; Hongjing Jiang;
Incorporation of �-conjugated Molecular Wires into Anisotropic Conductive Adhesive for High-performance Interconnection Applications
2008 / IEEE / 978-1-4244-2117-6
By: Kyoung Sik Moon; Rongwei Zhang; Wong, C.P.; Hongjin Jiang; Wei Lin;
Chemical Transfer of in-situ Functionalized Aligned Carbon Nanotube Structures for Microelectronic Packaging Applications
2008 / IEEE / 978-1-4244-2117-6
By: Wei Lin; Wong, C.P.; Kyoung-Sik Moon; Rongwei Zhang;
Enhanced Electrical Properties of Anisotropic Conductive Adhesive With $\pi$ -Conjugated Self-Assembled Molecular Wire Junctions
2009 / IEEE
By: Kyoung Sik Moon; Myung Jin Yim; Yi Li; Rongwei Zhang; Wong, C.P.; Lu, D.D.;
A Novel Conformal RFID-Enabled Module Utilizing Inkjet-Printed Antennas and Carbon Nanotubes for Gas-Detection Applications
2009 / IEEE
By: Wong, C.P.; Staiculescu, D.; Rongwei Zhang; Li Yang; Tentzeris, M.M.;
New electrically conductive adhesives (ECAs) for flexible interconnect applications
2009 / IEEE / 978-1-4244-4475-5
By: Rongwei Zhang; Wong, C.P.; Kyoung-sik Moon; Wei Lin; Yiqun Duan;
Electrical properties of ACA joints assisted by conjugated molecular wires
2009 / IEEE / 978-1-4244-4475-5
By: Kyoung-sik Moon; Rongwei Zhang; Wong, C.P.; Wei Lin;
Synthesis of High-Quality Vertically Aligned Carbon Nanotubes on Bulk Copper Substrate for Thermal Management
2010 / IEEE
By: Rongwei Zhang; Wei Lin; Wong, C.P.; Kyoung-Sik Moon;
Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology
2010 / IEEE / 978-1-4244-6412-8
By: Tummala, R.; Wong, C.P.; Bolanos-Avila, M.; Dunne, R.; Choudhury, A.; Rongwei Zhang; Raj, P.M.; Kumbhat, N.; Sundaram, V.;
Interfacial Design of Anisotropic Conductive Adhesive Based Interconnects Using Molecular Wires and Understanding of Their Electrical Conduction
2010 / IEEE
By: Lotz, S.M.; Yiqun Duan; Wei Lin; Kyoung-Sik Moon; Rongwei Zhang; Wong, C.P.;
Highly Reliable Copper-Based Conductive Adhesives Using an Amine Curing Agent for in Situ Oxidation/Corrosion Prevention
2011 / IEEE
By: Rongwei Zhang; Wong, C.P.; Qizhen Liang; Kyoung-Sik Moon; Wei Lin;
Recent advances on Electrically Conductive Adhesives
2010 / IEEE / 978-1-4244-8562-8
By: Rongwei Zhang; Wong, C.P.; Agar, J.C.;
Through silicone vias: Multilayer interconnects for stretchable electronics
2011 / IEEE / 978-1-61284-498-5
By: Wong, C.P.; Staiculescu, D.; Rongwei Zhang; Durden, J.; Agar, J.C.;
Modeling of Thermal Conductivity of Graphite Nanosheet Composites
2010 / Springer Science+Business Media / 0361-5235
By: Rongwei Zhang; Wei Lin; C.P. Wong;
Amelioration of Experimental Autoimmune Encephalomyelitis by β-elemene Treatment is Associated with Th17 and Treg Cell Balance
2011 / Springer Science+Business Media / 0895-8696
By: Hongmei Yu; Rongwei Zhang; Lei Chen; Huimin Zhang; Zhike Zhou; Ayong Tian;

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