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Author: Raj, P.M.

Results

Polymers for RF Apps
2011 / IEEE
By: Papapolymerou, J.; Sundaram, V.; Swaminathan, M.; Raj, P.M.;
Nanomagnetics for High-Performance, Miniaturized Power, and RF Components [Nanopackaging]
2012 / IEEE
By: Murali, K.P.; Mishra, D.; Sharma, H.; Raj, P.M.; Tummala, R.R.; Swaminathan, M.; Kyuhwan Han;
Integration of precision resistors and capacitors with near-zero temperature coefficients in silicon and organic packages
2012 / IEEE / 978-1-4673-1965-2
By: Murali, K.P.; Raj, P.M.; Berg, N.; Slenes, K.; Tummala, R.; Gandhi, S.;
Extraction of electrical properties of nanomagnetic materials through meander-shaped inductor and inverted-F antenna structures
2012 / IEEE / 978-1-4673-1965-2
By: Nair, V.; Tummala, R.; Murali, K.P.; Sharma, H.; Raj, P.M.; Swaminathan, M.; Kyu Han;
Colloidal processing of polymer ceramic nanocomposites for integral capacitors
2001 / IEEE / 0-930815-64-5
By: Windlass, H.; Raj, P.M.; Tummala, R.R.; Bhattacharya, S.K.; Balaraman, D.;
Evaluation of liquid crystal polymers for high performance SOP application
2002 / IEEE / 0-7803-7430-4
By: Wong, C.P.; Shinotani, K.; Bhattacharya, S.K.; Raj, P.M.; Brownlee, K.; Tummala, R.R.;
Evaluation of low stress dielectrics for board application
2003 / IEEE / 0-7803-7791-5
By: Raj, P.M.; Shinotani, K.; Brownlee, K.; Tummala, R.R.; Wong, C.P.; Bbattacharya, S.K.;
In-situ stress and warpage measurements to investigate reliability of flip-chip on board assembly without underfill
2003 / IEEE / 0-7803-7791-5
By: Shinotani, K.; Raj, P.M.; Bansal, S.; Lance, M.J.; Tummala, R.; Bhattacharya, S.;
Integration and high-frequency characterization of PWB-compatible pure barium titanate films synthesized by modified hydrothermal techniques (< 100/spl deg/C)
2003 / IEEE / 0-7803-7791-5
By: Lixi Wan; Balaraman, D.; Tummala, R.; Swaininathan, M.; Raj, P.M.; Dalmia, S.; Bhattacharya, S.; Abothu, I.R.;
Colloidal processing of polymer ceramic nanocomposite integral capacitors
2003 / IEEE
By: Bhattacharya, S.K.; Balaraman, D.; Raj, P.M.; Windlass, H.; Tummala, R.R.;
New package/board materials technology for next-generation convergent microsystems
2003 / IEEE / 0-7803-8205-6
By: Atmur, S.; Hayes, S.; Tummala, R.; Bhattacharya, S.; Kumbhat, N.; Bansal, S.; Raj, P.M.; Doraiswami, R.;
Sol-gel derived and repairable nano-interconnects
2003 / IEEE / 0-7803-8205-6
By: Ravi, D.; Raj, P.M.; Abothu, I.R.; Aggarwal, A.O.; Tummala, R.R.; Tay, A.O.; Sacks, M.D.;
Material synthesis routes for thin film bonding interfaces in reworkable and bumpless nano-interconnects
2004 / IEEE / 0-7803-8436-9
By: Sacks, M.D.; Ravi, D.; Abothu, I.R.; Raj, P.M.; Aggarwal, A.O.; Tummala, R.R.; Tay, A.A.O.;
High aspect ratio metal-polymer composite structures for nano interconnects
2004 / IEEE / 0-7803-8436-9
By: Aggarwal, A.O.; Tummala, R.R.; Raj, P.M.;
Simultaneous switching noise suppression using hydrothermal barium titanate thin film capacitors
2004 / IEEE / 0-7803-8365-6
By: Bhattacharya, S.; Abothu, I.R.; Patel, V.; Raj, P.M.; Lixi Wan; Jinwoo Choi; Balaraman, D.; Tummala, R.; Swaminathan, M.;
Development of high-k embedded capacitors on printed wiring board using sol-gel and foil-transfer processes
2004 / IEEE / 0-7803-8365-6
By: Tummala, R.R.; Lance, M.J.; Swaminathan, M.; Sacks, M.D.; Abothu, I.R.; Bhattacharya, S.; Govind, V.; Balaraman, D.; Raj, P.M.;
MEMS composite structures for tunable capacitors and IC-package nano interconnects
2004 / IEEE / 0-7803-8365-6
By: Bhattacharya, S.; Ayazi, F.; Raj, P.M.; Naeli, K.; Aggarwal, A.O.; Tummala, R.R.;
Multifunctional integrated substrate technology for high density SOP packaging
2004 / IEEE / 0-7803-8620-5
By: Bhattacharya, S.; Balaraman, D.; Chang, G.K.; Fuhan Liu; Tummala, R.R.; Sundaram, V.; Guidotti, D.; Zhaoran Huang; Chang, Y.-J.; Abothu, I.R.; Raj, P.M.;
Warpage-induced lithographic limitations of FR-4 and the need for novel board materials for future microvia and global interconnect needs
2005 / IEEE
By: Tummala, R.R.; Bhattacharya, S.; Raj, P.M.; Banerji, S.;
Design, fabrication, and reliability assessment of embedded resistors and capacitors on multilayered organic substrates
2005 / IEEE / 0-7803-9085-7
By: Balaraman, D.; Raj, P.M.; Sundaram, V.; Abothu, I.R.; Lixi Wan; Varadarajan, M.; Bhattacharya, S.; Lee, K.J.; Lauffer, J.; Dunford, S.; Viswanadham, P.; Muthana, P.; Tummala, R.; Sitaraman, S.; Swaminathan, M.;
50 Micron Pitch Wafer Level Packaging Testbed with Reworkable IC-Package Nano Interconnects
2005 / IEEE / 0-7803-8907-7
By: Raj, P.M.; Aggarwal, A.O.; Tummala, R.R.; Mullapudi, R.; Sauwee Koh; Ravi, D.; Sundaram, V.;
Exploring the limits of low cost, organics-compatible high-k ceramic thin films for embedded decoupling applications
2005 / IEEE / 0-7803-8907-7
By: Meyer, H.; Lance, M.; Bhattacharya, S.; Sacks, M.; Swaminathan, M.; Abothu, R.; Raj, P.M.; Balaraman, D.; Tumrnala, R.;
Recent Advances in Ceramic Composite Substrate Materials for High-Density and High Reliability Packaging Applications
2005 / IEEE / 0-7803-8907-7
By: Kumbhat, N.; Tummala, R.R.; Sitaraman, S.K.; Bhattacharya, S.; Sundaram, V.; Doraiswamy, R.; Atmur, S.; Pucha, R.V.; Raj, P.M.;
Embedded decoupling capacitor performance in high speed circuits
2005 / IEEE / 0-7803-8907-7
By: Raj, P.M.; Lixi Wan; Tummala, R.; Swaminathan, M.; Abothu, I.R.; Varadarajan, M.; Bhattacharya, S.K.; Muthana, P.; Balaraman, D.;
Packaging of multi-core microprocessors: tradeoffs and potential solutions
2005 / IEEE / 0-7803-8907-7
By: Raj, P.M.; Bhattacharya, S.K.; Lixi Wan; Sundaram, V.; Tummala, R.; Swaminathan, P.; Muthana, P.;
Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems
2005 / IEEE / 0-7803-9380-5
By: Raj, P.M.; Tummala, R.; Swaminathan, M.; Muthana, P.; Engin, E.; Bhattacharya, S.; Balaraman, D.; Lixi Wan;
Biofunctionalization of Multi-walled Carbon Nanotubes (MWNTs) for the Fabrication of Protein Nano Biosensors
2006 / IEEE / 1-4244-0260-3
By: Tummala, R.; Iyer, M.; Raj, P.M.; Goud, J.D.;
Integrating Solution-Derived 3D PZT Structures on Si Mems Platform for RF and Biomedical Applications
2006 / IEEE / 1-4244-0260-3
By: Tummala, R.; Ayazi, F.; Abdolvand, R.; Abothu, I.R.; Raj, P.M.;
Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic Packages
2007 / IEEE / 1-4244-0984-5
By: Yamamoto, H.; Iyer, M.; Kumar, M.; Jin Hyun Hwang; Raj, P.M.; Abothu, I.R.; Tummala, R.;
Electrochemical Biosensors and Microfluidics in Organic System-on-Package Technology
2007 / IEEE / 1-4244-0984-5
By: Raj, P.M.; Goud, J.D.; Tummala, R.; Iyer, M.; Narayan, R.; Jin Liu;
Organic-Based RF Capacitors with Ceramic-Like Properties
2007 / IEEE / 1-4244-0984-5
By: Jin-Hyun Hwang; Tummala, R.; Jong-Kuk Hong; Hyung-Mi Jung; Iyer, M.; Chong Yoon; Abothu, I.R.; Raj, P.M.;
Label-Free Protein Detection by ZnO Nanowire Based Bio-Sensors
2007 / IEEE / 1-4244-0984-5
By: Iyer, M.; Raj, P.M.; Goud, J.; Jin Liu; Tummala, R.R.; Zhonglin Wang;
Lead-Free Solder Films Via Novel Solution Synthesis Routes
2007 / IEEE
By: Aggarwal, A.O.; Tummala, R.R.; Sacks, M.D.; Raj, P.M.; Abothu, I.R.;
Novel Ceramic Composite Substrates for High-Density and High Reliability Packaging
2007 / IEEE
By: Kumbhat, N.; Tummala, R.R.; Sitaraman, S.K.; Bongio, E.; Raj, P.M.; Jui-Yun Tsai; Pucha, R.V.; Atmur, S.;
Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect
2008 / IEEE / 978-1-4244-2230-2
By: Mehrotra, G.; Bandyopadhyay, T.; Tummala, R.R.; Swaminathan, M.; Raj, P.M.; Iyer, M.K.;
Real-time protein detection using ZnO nanowire/thin film bio-sensor integrated with microfluidic system
2008 / IEEE / 978-1-4244-2230-2
By: Zhong Lin Wang; Iyer, M.; Raj, P.M.; Goud, J.; Jin Liu; Tummala, R.R.;
Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer
2008 / IEEE / 978-1-4244-2230-2
By: Venkatesan, M.; Jha, G.; Raj, P.M.; Goud, J.D.; Iyer, M.; Mehrotra, G.; Tummala, R.; Hess, D.;
Antenna miniaturization using magneto-dielectric substrates
2009 / IEEE / 978-1-4244-4475-5
By: Raj, P.M.; Swaminathan, M.; Altunyurt, N.; Nair, V.;
Highly-reliable, 30�m pitch copper interconnects using nano-ACF/NCF
2009 / IEEE / 978-1-4244-4475-5
By: Chatterjee, R.; Moon, K.S.; Zhang, R.; Raj, P.M.; Mehrotra, G.; Raine, M.; Sundaram, V.; Kumbhat, N.; Tummala, R.R.; Choudhury, A.; Wong, C.P.; Meyer-Berg, G.;
Trend from ICs to 3D ICs to 3D systems
2009 / IEEE / 978-1-4244-4071-9
By: Choudury, A.; Sridharan, V.; Sukumaran, V.; Raj, P.M.; Kumbhat, N.; Qiao Chen; Chatterjee, R.; Sundaram, V.; Tummala, R.R.; Bandyopadhyay, T.;
Low temperature, low profile, ultra-fine pitch copper-to-copper chip-last embedded-active interconnection technology
2010 / IEEE / 978-1-4244-6412-8
By: Tummala, R.; Wong, C.P.; Bolanos-Avila, M.; Dunne, R.; Choudhury, A.; Rongwei Zhang; Raj, P.M.; Kumbhat, N.; Sundaram, V.;
Co-W as an advanced barrier for intermetallics and electromigration in fine-pitch flipchip interconnections
2011 / IEEE / 978-1-61284-498-5
By: Pucha, R.V.; Addya, S.; Khan, S.; Yushu Wang; Kumbhat, N.; Choudhury, A.; Raj, P.M.; Mishra, D.; Tummala, R.; Sundaram, V.;
Conformal Atomic Layer Deposition (ALD) of alumina on high surface-area porous copper electrodes to achieve ultra-high capacitance density on silicon interposers
2011 / IEEE / 978-1-61284-498-5
By: Sethi, K.; Tummala, R.; Sundaram, V.; Raj, P.M.; Sharma, H.;
Solution-derived electrodes and dielectrics for low-cost and high-capacitance trench and Through-Silicon-Via (TSV) capacitors
2011 / IEEE / 978-1-61284-498-5
By: Tummala, R.; Williams, B.; Sharma, H.; Raj, P.M.; Shu Xiang; Yushu Wang;

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