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Author: Nishi, Y.
Results
2012 / IEEE
By: Grubbs, M.E.; Deal, M.; Hoffmann, T.; Ragnarsson, L.; Mitard, J.; Jing Li; Nishi, Y.; Xiao Zhang; Clemens, B.M.; Magyari-Kope, B.;
By: Grubbs, M.E.; Deal, M.; Hoffmann, T.; Ragnarsson, L.; Mitard, J.; Jing Li; Nishi, Y.; Xiao Zhang; Clemens, B.M.; Magyari-Kope, B.;
2011 / IEEE / 978-1-61284-329-2
By: Shohet, J.L.; Nishi, Y.; Antonelli, G.A.; Jiang, G.; Nichols, M.T.; Ren, H.;
By: Shohet, J.L.; Nishi, Y.; Antonelli, G.A.; Jiang, G.; Nichols, M.T.; Ren, H.;
High-efficiency Cu2 O-based heterojunction solar cells fabricated on thermally oxidized copper sheets
2011 / IEEE / 978-1-4244-9965-6By: Nishi, Y.; Minami, T.; Nomoto, J.; Miyata, T.;
2012 / IEEE / 978-1-4673-1081-9
By: Gilmer, D.C.; Young-Fisher, K.G.; Bersuker, G.; Butcher, B.; Kalantarian, A.; Kirsch, P.D.; Jammy, R.; Geer, R.; Nishi, Y.;
By: Gilmer, D.C.; Young-Fisher, K.G.; Bersuker, G.; Butcher, B.; Kalantarian, A.; Kirsch, P.D.; Jammy, R.; Geer, R.; Nishi, Y.;
2012 / IEEE / 978-1-4673-1081-9
By: Jammy, R.; Kirsch, P.D.; Nishi, Y.; Geer, R.; Butcher, B.; Kalantarian, A.; Jo, M.; Koveshnikov, S.; Bersuker, G.; Gilmer, D.C.;
By: Jammy, R.; Kirsch, P.D.; Nishi, Y.; Geer, R.; Butcher, B.; Kalantarian, A.; Jo, M.; Koveshnikov, S.; Bersuker, G.; Gilmer, D.C.;
2012 / IEEE / 978-1-4673-0238-8
By: Park, S.G.; Shiraishi, K.; Yang, M.; Yamaguchi, K.; Kamiya, K.; Nishi, Y.; Niwa, M.; Magyari-Kope, B.; Shigeta, Y.;
By: Park, S.G.; Shiraishi, K.; Yang, M.; Yamaguchi, K.; Kamiya, K.; Nishi, Y.; Niwa, M.; Magyari-Kope, B.; Shigeta, Y.;
2012 / IEEE / 978-1-4577-1865-6
By: Donguk Nam; Saraswat, K.; Nishi, Y.; Brongersma, M.; Huang, K.C.; Szu-Lin Cheng; Sukhdeo, D.;
By: Donguk Nam; Saraswat, K.; Nishi, Y.; Brongersma, M.; Huang, K.C.; Szu-Lin Cheng; Sukhdeo, D.;
2012 / IEEE / 978-1-4577-1865-6
By: Maszara, W.P.; Shurong Liang; Gupta, S.; Roy, A.; Nishi, Y.; Lin, J.-Y.J.; Bin Yang; Saraswat, K.;
By: Maszara, W.P.; Shurong Liang; Gupta, S.; Roy, A.; Nishi, Y.; Lin, J.-Y.J.; Bin Yang; Saraswat, K.;
2012 / IEEE / 978-1-4673-0847-2
By: Gunji, M.; Dekoster, J.; Lin, D.H.C.; Vincent, B.; Gupta, S.; Saraswat, K.C.; Nishi, Y.; Firrincieli, A.; Caymax, M.; Franquet, A.; Delmotte, J.; Douhard, B.; Yang, B.; Magyari-Kope, B.; Gencarelli, F.;
By: Gunji, M.; Dekoster, J.; Lin, D.H.C.; Vincent, B.; Gupta, S.; Saraswat, K.C.; Nishi, Y.; Firrincieli, A.; Caymax, M.; Franquet, A.; Delmotte, J.; Douhard, B.; Yang, B.; Magyari-Kope, B.; Gencarelli, F.;
2011 / IEEE
By: Boos, J.B.; Bennett, B.R.; Ze Yuan; Irisawa, T.; Nainani, A.; Saraswat, K.C.; Nishi, Y.;
By: Boos, J.B.; Bennett, B.R.; Ze Yuan; Irisawa, T.; Nainani, A.; Saraswat, K.C.; Nishi, Y.;
2013 / IEEE
By: Kalantarian, A.; Bersuker, G.; Butcher, B.; Gilmer, D.C.; Privitera, S.; Lombardo, S.; Geer, R.; Jammy, R.; Kirsch, P.; Nishi, Y.;
By: Kalantarian, A.; Bersuker, G.; Butcher, B.; Gilmer, D.C.; Privitera, S.; Lombardo, S.; Geer, R.; Jammy, R.; Kirsch, P.; Nishi, Y.;
2013 / IEEE
By: Nam, J. H.; Saraswat, K. C.; Park, J.-H.; Nishi, Y.; Ito, T.; Shim, J.; Jung, W. S.;
By: Nam, J. H.; Saraswat, K. C.; Park, J.-H.; Nishi, Y.; Ito, T.; Shim, J.; Jung, W. S.;
2014 / IEEE
By: Traore, B.; Xue, K.; Nishi, Y.; Magyari-Kope, B.; Blaise, P.; De Salvo, B.; Molas, G.; Vianello, E.; Fonseca, L.R.C.; Ghibaudo, G.;
By: Traore, B.; Xue, K.; Nishi, Y.; Magyari-Kope, B.; Blaise, P.; De Salvo, B.; Molas, G.; Vianello, E.; Fonseca, L.R.C.; Ghibaudo, G.;
1994 / IEEE
By: Cass, T.R.; Marcoux, P.; Phillips, B.; Nishi, Y.; Sau-Lan Ng; Hayes, D.M.; Clark, R.R.;
By: Cass, T.R.; Marcoux, P.; Phillips, B.; Nishi, Y.; Sau-Lan Ng; Hayes, D.M.; Clark, R.R.;
1999 / IEEE / 0-7695-0007-2
By: Oguri, K.; Yamaguchi, Y.; Okada, T.; Mori, K.; Matsumura, T.; Yasuoka, T.; Mitsuzawa, S.; Nishi, Y.;
By: Oguri, K.; Yamaguchi, Y.; Okada, T.; Mori, K.; Matsumura, T.; Yasuoka, T.; Mitsuzawa, S.; Nishi, Y.;
2000 / IEEE / 0-7803-5950-X
By: Nishi, Y.; Kando, W.; Ushiyama, J.; Hirotsune, A.; Miyamoto, M.; Maeda, T.; Terao, M.;
By: Nishi, Y.; Kando, W.; Ushiyama, J.; Hirotsune, A.; Miyamoto, M.; Maeda, T.; Terao, M.;
Two-Dimensional Nature of Diffused Layers and Certain Limitations in Scaling-Down Coplanar Structure
1982 / IEEEBy: Maeda, S.; Konaka, M.; Taniguchi, K.; Iwai, H.; Nishi, Y.;
2002 / IEEE / 0-7803-7442-8
By: Oodo, M.; Tsuji, H.; Suzuki, M.; Maruyama, M.; Miura, R.; Nishi, Y.;
By: Oodo, M.; Tsuji, H.; Suzuki, M.; Maruyama, M.; Miura, R.; Nishi, Y.;
2004 / IEEE / 0-7803-8684-1
By: Uchida, K.; Nishi, Y.; McIntyre, P.C.; McVittie, J.; Jagannathan, H.; Ching-Huang Lu; Zednik, R.;
By: Uchida, K.; Nishi, Y.; McIntyre, P.C.; McVittie, J.; Jagannathan, H.; Ching-Huang Lu; Zednik, R.;
2005 / IEEE
By: Colombo, L.; Wong, G.M.T.; Ching-Huang Lu; Nishi, Y.; Clemens, B.M.; Deal, M.D.; Chambers, J.J.; Visokay, M.R.; Chi On Chui; Majhi, P.; Tsai, W.;
By: Colombo, L.; Wong, G.M.T.; Ching-Huang Lu; Nishi, Y.; Clemens, B.M.; Deal, M.D.; Chambers, J.J.; Visokay, M.R.; Chi On Chui; Majhi, P.; Tsai, W.;
2005 / IEEE / 0-7803-9009-1
By: Nishi, Y.; Tsukayama, Y.; Takahashi, K.; Masuda, S.; Kadowaki, A.; Matsumura, Y.;
By: Nishi, Y.; Tsukayama, Y.; Takahashi, K.; Masuda, S.; Kadowaki, A.; Matsumura, Y.;
2005 / IEEE / 4-900784-00-1
By: Nishi, Y.; Uchida, K.; Krivokapic, Z.; Krishnamohan, T.; Saraswat, K.C.;
By: Nishi, Y.; Uchida, K.; Krivokapic, Z.; Krishnamohan, T.; Saraswat, K.C.;
Two-dimensional nature of diffused layers and certain limitations in scaling-down coplanar structure
1982 / IEEEBy: Iwai, H.; Taniguchi, K.; Konaka, M.; Maeda, S.; Nishi, Y.;
2002 / IEEE / 87-90974-63-8
By: Minagawa, K.; Nishi, Y.; Iida, Y.; Abe, H.; Mizuno, K.; Nanri, N.; Ito, T.;
By: Minagawa, K.; Nishi, Y.; Iida, Y.; Abe, H.; Mizuno, K.; Nanri, N.; Ito, T.;
2005 / IEEE / 0-7803-9268-X
By: Nishi, Y.; Yonehara, T.; Yamagata, K.; Koto, M.; McVittie, J.; Sanda, H.;
By: Nishi, Y.; Yonehara, T.; Yamagata, K.; Koto, M.; McVittie, J.; Sanda, H.;
2006 / IEEE
By: Krishnamohan, T.; Donghyun Kim; Saraswat, K.C.; Jungemann, C.; Nishi, Y.; Chi Dong Nguyen;
By: Krishnamohan, T.; Donghyun Kim; Saraswat, K.C.; Jungemann, C.; Nishi, Y.; Chi Dong Nguyen;
2006 / IEEE / 1-4244-0005-8
By: Nishi, Y.; Jungemann, C.; Donghyun Kim; Krishnamohan, T.; Saraswat, K.C.;
By: Nishi, Y.; Jungemann, C.; Donghyun Kim; Krishnamohan, T.; Saraswat, K.C.;
Resistive Switching Mechanism in $\hbox{Zn}_{x}\hbox{Cd}_{1 - x}\hbox{S}$ Nonvolatile Memory Devices
2007 / IEEEBy: Zheng Wang; Nishi, Y.; McIntyre, P.C.; Simon Wong; McVittie, J.; Griffin, P.B.;
2006 / IEEE / 1-4244-0438-X
By: Fujita, S.; Tze Wee Chen; Gibby, A.; Zheng Wang; Griffin, P.; Wei Wang; Wong, S.; Nishi, Y.;
By: Fujita, S.; Tze Wee Chen; Gibby, A.; Zheng Wang; Griffin, P.; Wei Wang; Wong, S.; Nishi, Y.;
2006 / IEEE / 1-4244-0438-X
By: Saraswat, K.; Nishi, Y.; Wong, P.; Selberherr, S.; Krishnamohan, T.; Donghyun Kim; Jungemann, C.; Ungersboeck, E.;
By: Saraswat, K.; Nishi, Y.; Wong, P.; Selberherr, S.; Krishnamohan, T.; Donghyun Kim; Jungemann, C.; Ungersboeck, E.;
2006 / IEEE / 1-4244-0438-X
By: Toriyama, S.; Uchida, K.; Nishi, Y.; Kinoshita, T.; Kinoshita, A.; Koga, J.; Hasumi, R.;
By: Toriyama, S.; Uchida, K.; Nishi, Y.; Kinoshita, T.; Kinoshita, A.; Koga, J.; Hasumi, R.;
2007 / IEEE / 1-4244-0584-X
By: El-Gamal, A.; Wong, S.; Plummer, J.; Pease, F.; Nishi, Y.; Griffin, P.;
By: El-Gamal, A.; Wong, S.; Plummer, J.; Pease, F.; Nishi, Y.; Griffin, P.;
2007 / IEEE / 978-4-900784-03-1
By: Nishi, Y.; Chidsey, C.E.D.; Ratchford, J.B.; Jagannathan, H.; Wong, H.-S.P.; SangBum Kim; Yuan Zhang; McVittie, J.P.;
By: Nishi, Y.; Chidsey, C.E.D.; Ratchford, J.B.; Jagannathan, H.; Wong, H.-S.P.; SangBum Kim; Yuan Zhang; McVittie, J.P.;
2007 / IEEE / 978-4-900784-03-1
By: Skotnicki, T.; Patton, G.; Arghavani, R.; Inaba, S.; Liang, M.; Chau, R.; Nishi, Y.; Toyoshima, Y.;
By: Skotnicki, T.; Patton, G.; Arghavani, R.; Inaba, S.; Liang, M.; Chau, R.; Nishi, Y.; Toyoshima, Y.;
2007 / IEEE / 978-1-4244-1101-6
By: Ching-Huang Lu; Nishi, Y.; Clemens, B.M.; Deal, M.; Wong, G.M.T.;
By: Ching-Huang Lu; Nishi, Y.; Clemens, B.M.; Deal, M.; Wong, G.M.T.;