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Author: Liao, E.B.

Results

TSV process optimization for reduced device impact on 28nm CMOS
2011 / IEEE / 978-1-4244-9949-6
By: Yu, C.L.; Yu, C.H.; Jeng, S.P.; Tung, C.H.; Chiou, W.C.; Wu, T.J.; Yang, K.F.; Liao, E.B.; Lin, W.L.; Hou, S.Y.; Tai, S.P.; Kuo, C.W.; Huang, L.H.; Chang, J.H.; Wang, H.Y.; Chang, C.H.;
High-aspect ratio through silicon via (TSV) technology
2012 / IEEE / 978-1-4673-0847-2
By: Lin, Y.C.; Chen, Y.H.; Lin, T.C.; Wei, T.S.; Liao, E.B.; Chien, C.H.; Kuo, P.C.; Chen, H.Y.; Chang, H.B.; Yu, C.H.; Jeng, S.P.; Chiou, W.C.; Hou, S.Y.; Wu, T.J.; Liu, Y.H.; Chen, M.F.; Hsieh, C.C.; Chen, S.Y.; Tseng, Y.C.; Tsai, W.C.; Teng, H.A.; Yang, K.F.;
Fabrication and parametric study of wafer-level multiple-copper-column interconnect
2004 / IEEE / 0-7803-8365-6
By: Tay, A.A.O.; Ang, S.S.; Liao, E.B.; Kripesh, V.; Nagarajan, R.; Feng, H.H.;
Effects of wetting angle and loading direction on fatigue behavior of multi-copper column flip-chip interconnects
2004 / IEEE / 0-7803-8821-6
By: Ang, S.S.T.; Tay, A.A.O.; Liao, E.B.; Kripesh, V.; Nagarajan, R.; Feng, H.H.;
High-density MIM capacitors (/spl sim/85 nF/cm/sup 2/) on organic substrates
2005 / IEEE
By: Liao, E.B.; Kwong, D.L.; Balasubramanian, N.; Lo, G.Q.; Kumar, R.; Guo, L.H.;
Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates
2005 / IEEE / 0-7803-9268-X
By: Li, H.Y.; Zhang, Q.X.; Guo, L.H.; Kwong, D.L.; Balasubramanian, N.; Liao, E.B.; Lo, G.Q.; Kuo, C.C.; Loh, W.Y.; Bera, L.K.;
Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects
2005 / IEEE / 0-7803-9578-6
By: Mahadevan, I.; Ang, S.S.T.; Tay, A.A.O.; Liao, E.B.; Feng, H.H.; Kumar, R.; Kripesh, V.; Nagarajan, R.;
Numerical analysis on compliance and electrical behavior of multi-copper-column flip-chip interconnects for wafer-level packaging
2006 / IEEE
By: Feng, H.H.; Ang, S.S.; Tay, A.A.O.; Liao, E.B.; Kripesh, V.; Nagarajan, R.;
Bendability of single-crystal Si MOSFETs investigated on flexible substrate
2006 / IEEE
By: Li, H.Y.; Guo, L.H.; Balasubramanian, N.; Lo, G.Q.; Cheng, C.K.; Shen, Z.X.; Chua, H.M.; Kwong, D.-L.; Teoh, K.W.; Liao, E.B.; Hwang, N.; Zhang, Q.X.; Bera, L.K.; Loh, W.Y.;
A MEMS-based compliant interconnect for ultra-fine-pitch wafer level packaging
2006 / IEEE / 1-4244-0152-6
By: Iyer, M.K.; Kumar, R.; Kripesh, V.; Nagarajan, R.; Liao, E.B.; Ang, S.S.T.; Tay, A.A.O.; Feng, H.H.;
Fatigue and Bridging Study of High-Aspect-Ratio Multicopper-Column Flip-Chip Interconnects Through Solder Joint Shape Modeling
2006 / IEEE
By: Ang, S.S.T.; Tay, A.A.O.; Liao, E.B.; Kripesh, V.; Nagarajan, R.; Feng, H.H.;
RF, DC, and Reliability Performance of MIM Capacitors Embedded in Organic Substrates by Wafer-Transfer Technology (WTT) for System-on-Package Applications
2007 / IEEE
By: Hongyu Li; Liao, E.B.; Dim-Lee Kwong; Balasubramanian, N.; Kumar, R.; Guo-Qiang Lo; Guo, L.H.;
Shape matching-assisted self-assembly of microchips on a silicon substrate
2006 / IEEE / 1-4244-0664-1
By: Lim, Y.L.; Yan, L.L.; Kripesh, V.; Liao, E.B.; Ong, Y.Y.;
Moisture effect on adhesive bonding strength characterized by crack opening method
2006 / IEEE / 1-4244-0664-1
By: Liao, E.B.; Li, B.H.; Chai, T.C.; Totong, K.; Lo, G.Q.;
Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System
2006 / IEEE / 1-4244-0438-X
By: Tang, M.; Liao, E.B.; Guo, L.H.; Yu, A.B.; Li, H.Y.; Yang, R.; Kumar, R.; Zhang, Q.X.; Kwong, D.L.; Balasubramanian, N.; Lo, G.Q.; Liu, A.Q.;
A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate
2007 / IEEE / 1-4244-0841-5
By: Kwong, D.L.; Balasubramanian, N.; Lo, G.Q.; Liu, A.Q.; Kumar, R.; Guo, L.H.; Zhang, Q.X.; Liao, E.B.; Yang, R.; Li, H.Y.; Tang, M.; Yu, A.B.;
Dry Self-Assembly & Gang bonding of micro-components from silicon carrier to substrate wafer
2006 / IEEE / 978-1-4244-0729-3
By: Lim, Y.L.; Ong, Y.Y.; Kripesh, V.; Liao, E.B.; Yan, L.L.;
Self-Assembly of Components using Shape-matching
2007 / IEEE / 978-1-4244-1324-9
By: Vempati, S.; Yan, L.L.; Lim, Y.L.; Ong, Y.Y.; Yoon, S.U.; Kripesh, V.; Liao, E.B.;
High performance embedded RF passive device process integration
2008 / IEEE / 978-1-4244-2230-2
By: Li, H.Y.; Rakesh, K.; Kripesh, V.; Mohanraj, S.; Khan, N.; Khoo, Y.M.; Li, H.B.; Rao, V.S.; Teoh, K.W.; Liao, E.B.;
Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique
2008 / IEEE / 978-1-4244-2230-2
By: Lo, G.Q.; Rong Yang; Liao, E.B.; Yu, A.B.; Balasubramanian, N.; Li, H.Y.; Zhang, Q.X.; Tang, M.; Kwong, D.L.;
Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer
2008 / IEEE
By: Zhang, Q.X.; Dim Lee Kwong; Balasubramanian, N.; Guo Qiang Lo; Min Tang; Yu, A.B.; Liao, E.B.; Guo, L.H.; Li, H.Y.; Rong Yang;
A low insertion loss 60 GHz band pass filter using wafer transfer
2008 / IEEE / 978-1-4244-2641-6
By: Guo, Y.X.; Luo, B.; Liao, E.B.; Wang, J.P.;
Development of through silicon via (TSV) interposer technology for large die (21�1mm) fine-pitch Cu/low-k FCBGA package
2009 / IEEE / 978-1-4244-4475-5
By: Selvanayagam, C.S.; Ranganathan, N.; Lau, J.H.; Chai, T.C.; Zhang, X.; Vath, C.J.; Doricko, J.; Jiangyan Sun; Kripesh, V.; Biswas, K.; Liao, E.B.; Li, H.Y.; Wai, E.; Vempati, S.R.; Ong, Y.Y.; Tang, G.Y.; Pinjala, D.; Shiguo Liu;
Development of 3-D Silicon Module With TSV for System in Packaging
2010 / IEEE
By: Lim, S.; Rao, V.S.; Khan, N.; Lau, J.H.; Kripesh, V.; Ho Soon We; Chai, T.C.; Nagarajan, R.; Liao, E.B.; Xiaowu Zhang; Lee, V.;
Characterization and management of wafer stress for various pattern densities in 3D integration technology
2010 / IEEE / 978-1-4244-6412-8
By: Chua, T.T.; Pang, X.F.; Che, F.X.; Lee, W.S.; Liao, E.B.; Li, H.Y.;
3D interconnection process development and integration with low stress TSV
2010 / IEEE / 978-1-4244-6412-8
By: Khong, C.H.; Li, H.Y.; Ho, S.W.; Chua, T.T.; Toh, C.H.; Nathapong, S.; Liao, E.B.; Kriangsak, S.L.; Ng, C.; Pang, X.F.; Lim, L.S.; Lee, W.S.; Chew, S.P.;

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