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Author: Li, H.Y.

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Three-Dimensional Solenoids Realized via High-Density Deep Coil Stacking for MEMS Application
2012 / IEEE
By: Kwong, D.L.; Gao, S.; Chong, S.C.; Hirshberg, A.; Li, H.Y.; Baram, A.; Ong, L.G.; Xie, L.; Herer, I.;
Development of Wafer-Level Warpage and Stress Modeling Methodology and Its Application in Process Optimization for TSV Wafers
2012 / IEEE
By: Faxing Che; Teo, K.H.; Shan Gao; Xiaowu Zhang; Li, H.Y.;
Testing and modelling of voltage transformer for high order harmonic measurement
2011 / IEEE / 978-1-4577-0365-2
By: Ghassemi, F.; Crossley, P.; Li, H.Y.; Zhao, S.;
Review on Supply Chain Risk and Its Management Methods
2011 / IEEE / 978-1-4244-6581-1
By: Li, H.Y.; Yu, Z.D.;
A Study on the Effects of Demand Uncertainty Based on Stackelberg Game in Supply Chain
2011 / IEEE / 978-1-4244-6581-1
By: Li, H.Y.; Yu, Z.D.;
Transient response of proton exchange membrane fuel cell with serpentine flow field
2011 / IEEE / 978-1-61284-486-2
By: Li, H.Y.; Weng, W.C.; Yan, W.M.; Kuo, J.K.;
Tomographic retrieval of atmosphere temperature profiles from Limb infrared emission by ENVISAT MIPAS
2011 / IEEE / 978-1-4577-1005-6
By: Li, H.Y.; Wang, Z.J.; Zhang, G.Z.; Chen, S.B.;
Redistribution layer (RDL) process development and improvement for 3D interposer
2011 / IEEE / 978-1-4577-1982-0
By: Teo, K.H.; Trigg, A.D.; Che, F.X.; Chua, H.M.; Li, H.Y.; Gao, S.;
Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect
2012 / IEEE
By: Dongzhi Chi; Murthy, R.; Siao Li Liew; Cheng, C.K.; Yeow Meng Tan; Chai, T.C.; Lau, J.; Khan, O.K.N.; Sekhar, V.N.; Li, H.Y.; Zhang, X.;
Operating TSV in Stable Accumulation Capacitance Region by Utilizing $\hbox{Al}_{2}\hbox{O}_{3}$-Induced Negative Fixed Charge
2012 / IEEE
By: Zhang, L.; Peng, L.; Li, H.Y.; Lo, G.Q.; Kwong, D.L.; Tan, C.S.;
A New Approach to Phase Selection Using Fault Generated High Frequency Noise and Neural Networks
1997 / IEEE
By: Song, Y.H.; Li, H.Y.; Johos, A.T.; Aggarwal, R.K.; Bo, Z.Q.;
A new approach to phase selection using fault generated high frequency noise and neural networks
1997 / IEEE
By: Aggarwal, R.K.; Bo, Z.Q.; Song, Y.H.; Li, H.Y.; Johns, A.T.;
A new type of differential feeder protection relay using the Global Positioning System for data synchronization
1997 / IEEE
By: Crossley, P.A.; Southern, E.P.; Li, H.Y.; Weller, G.C.; Caunce, B.R.J.; Pickering, S.D.A.; Potts, S.;
Design and evaluation of a circulating current differential relay test system
1998 / IEEE
By: Parker, A.D.; Li, H.Y.; Crossley, P.A.;
Gallium arsenide based micro-accelerometers
1997 / IEEE / 0-7803-3694-1
By: Stevanovich, S.; Schiller, P.J.; Polla, D.L.; Vu, J.N.C.; Nguyen, C.H.; Li, H.Y.; Nguyen, P.C.; Vu, T.T.; Harjani, R.; Vu, L.T.; Yang, Y.Q.;
Design and evaluation of a current differential protection scheme incorporating a fiber optical current sensor
2000 / IEEE / 0-7803-6420-1
By: Crossly, P.A.; Li, H.Y.;
Initial work of whole glass flat panel type vacuum fluorescent light source
2001 / IEEE / 0-7803-7197-6
By: Chen, S.F.; Lu, Y.J.; Xia, S.H.; Liu, G.Y.; Li, H.Y.; Wang, J.Y.; Cui, S.; Zhang, T.J.;
Optimum message transfer rate for distribution feeder protection operating over switched telephone networks
2002 / IEEE
By: Li, H.Y.; Crossley, P.A.;
La/sub 2/O/sub 3//Si/sub 0.3/Ge/sub 0.7/ p-MOSFETs and Ni germano-silicide
2003 / IEEE / 0-7803-7765-6
By: Chin, A.; Chen, W.J.; Li, H.Y.; Lin, C.Y.; Huang, C.H.; Mei, P.;
Optimized noise and consistent RF model for 0.18 /spl mu/m MOSFETs
2003 / IEEE / 0-7803-7765-6
By: Li, H.Y.; Huang, C.H.; Chien, S.C.; Liang, V.; Chin, A.;
Calculations concerning the electron transit time for an ideal cylindrical vacuum microelectronics diode
2004 / IEEE / 0-7803-8397-4
By: Chen, B.X.; Lu, Y.J.; Wu, J.S.; Li, H.Y.; Ding, Y.G.; Xia, S.H.; Liu, G.Y.;
Calculations concerning the electron transit time for an ideal spherical vacuum microelectronics diode
2004 / IEEE / 0-7803-8437-7
By: Wu, J.S.; Li, H.Y.; Ding, Y.G.; Xia, S.H.; Liu, G.Y.; Chen, B.X.; Lu, Y.J.;
Built-in via module test structure for backend interconnection in-line process monitor
2005 / IEEE / 0-7803-9301-5
By: Li, H.Y.; Hwang, N.; Wong, L.Y.; Li, W.H.;
A small OCA on a 1/spl times/0.5-mm/sup 2/ 2.45-GHz RFID Tag-design and integration based on a CMOS-compatible manufacturing technology
2006 / IEEE
By: Guo, L.H.; Kwong, D.-L.; Balasubramanian, N.; Lo, G.Q.; Popov, A.P.; Bliznetsov, V.; Wang, Y.H.; Li, H.Y.;
High-density CMOS interconnect realized on flexible organic substrate
2006 / IEEE
By: Li, H.Y.; Kwong, D.-L.; Balasubraminian, N.; Lo, G.Q.; Hwang, N.; Teoh, K.W.; Zhang, Q.X.; Guo, L.H.;
Successful transferring of active transistors, rf-passive components and high density interconnect from bulk si to organic substrates
2005 / IEEE / 0-7803-9268-X
By: Li, H.Y.; Zhang, Q.X.; Guo, L.H.; Kwong, D.L.; Balasubramanian, N.; Liao, E.B.; Lo, G.Q.; Kuo, C.C.; Loh, W.Y.; Bera, L.K.;
Electronics calculations for an ideal planar parallel vacuum microelectronics diode
2005 / IEEE / 0-7803-8397-4
By: Xia, S.H.; Chen, X.D.; Liu, G.Y.; Chen, B.X.; Yang, J.X.; Li, H.Y.; Ding, Y.G.;
Bendability of single-crystal Si MOSFETs investigated on flexible substrate
2006 / IEEE
By: Li, H.Y.; Guo, L.H.; Balasubramanian, N.; Lo, G.Q.; Cheng, C.K.; Shen, Z.X.; Chua, H.M.; Kwong, D.-L.; Teoh, K.W.; Liao, E.B.; Hwang, N.; Zhang, Q.X.; Bera, L.K.; Loh, W.Y.;
The Perturbed Trajectories Prediction Method Based on Wide-Area Measurement System
2006 / IEEE / 0-7803-9194-2
By: Bi, T.S.; Song, F.F.; Liu, Y.; Yang, Q.X.; Li, H.Y.;
Thermal Reliability of Cu/low -�(Black-DiamondTM, BD) Interconnects on Flexible Organic Substrate
2006 / IEEE / 1-4244-0205-0
By: Lo, G.Q.; Guo, L.H.; Chua, H.M.; Bai, J.S.; Li, H.Y.;
Design and Manufacturing of Small Area On-Chip-Antenna (OCA) for RFID Tags
2006 / IEEE / 1-4244-0301-4
By: Li, H.Y.; Chen, X.S.; Choi, Y.B.; Yeoh, W.G.; Tang, M.; Kwong, D.L.; Guo, L.H.; Baiasubramanian, N.; Lo, G.Q.;
Some Initial Application Researches From CNT's Thin Film and Carbon Material
2006 / IEEE / 1-4244-0401-0
By: Ding, Y.G.; Zhao, R.Q.; Shao, Y.J.; Lu, Y.J.; Wu, J.S.; Li, H.Y.; Wang, J.Y.; Xia, S.H.; Liu, G.Y.; Wang, W.Y.;
BCB (Benzocylcobutene) process integration for the RF passive device
2006 / IEEE / 1-4244-0664-1
By: Li, H.Y.; Lo, G.Q.; Guo, L.H.; Tang, M.;
Novel Monolithic Integration of RF-MEMS Switch with CMOS-IC on Organic Substrate for Compact RF System
2006 / IEEE / 1-4244-0438-X
By: Tang, M.; Liao, E.B.; Guo, L.H.; Yu, A.B.; Li, H.Y.; Yang, R.; Kumar, R.; Zhang, Q.X.; Kwong, D.L.; Balasubramanian, N.; Lo, G.Q.; Liu, A.Q.;
Development of Automated Fault Location Software for Distribution Network
2006 / IEEE / 1-4244-0273-5
By: Khalid, A.R.; Mokhlis, H.; Li, H.Y.;
EHD Enhanced Heat Transfer with Needle-Arrayed Electrodes
2007 / IEEE / 1-4244-0958-6
By: Wang, C.C.; Sheu, W.J.; Huang, R.T.; Li, H.Y.;
Broadband Impedance Matching Circuit Design Using Numerical Optimisation Techniques and Field Measurements
2007 / IEEE / 1-4244-1089-4
By: Rowland, S.M.; Onado, F.; Carcelle, X.; Goldberg, M.; Li, H.Y.; Yang, S.N.;
Assessment of Switched Communication Network Availability for State Estimation of Distribution Networks With Generation
2007 / IEEE
By: Li, H.Y.; Yunus, B.;
A Wafer Transfer Technology for Integration of RF MEMS and CMOS on Organic Substrate
2007 / IEEE / 1-4244-0841-5
By: Kwong, D.L.; Balasubramanian, N.; Lo, G.Q.; Liu, A.Q.; Kumar, R.; Guo, L.H.; Zhang, Q.X.; Liao, E.B.; Yang, R.; Li, H.Y.; Tang, M.; Yu, A.B.;
Data Management of Aero Engine Turbine Design Integration System
2007 / IEEE / 1-4244-1311-7
By: Li, H.Y.; Cui, D.L.; Ma, M.X.;
Fault location estimation for distribution system using simulated voltage sags data
2007 / IEEE / 978-1-905593-36-1
By: Li, H.Y.; Mokhlis, H.;
Forced convection air cooling in porous graphite foam for thermal management applications
2008 / IEEE / 978-1-4244-1700-1
By: Chai, J.C.; Li, H.Y.; Jin, L.W.; Leong, K.C.;
Impact of packaging design on reliability of large die Cu/low-� (BD) interconnect
2008 / IEEE / 978-1-4244-2230-2
By: Thew, M.L.; Navas, O.K.; Hnin, W.Y.; Sekhar, V.N.; Li, H.Y.; Xiaowu Zhang; Chai, T.C.; Zhu, W.H.; Chi, D.Z.; Liew, S.L.; Cheng, C.K.; Tan, Y.M.; Balakumar, S.; Murthy, R.; Lau, J.;
High performance embedded RF passive device process integration
2008 / IEEE / 978-1-4244-2230-2
By: Li, H.Y.; Rakesh, K.; Kripesh, V.; Mohanraj, S.; Khan, N.; Khoo, Y.M.; Li, H.B.; Rao, V.S.; Teoh, K.W.; Liao, E.B.;
Integration of RF-MEMS, passives and CMOS-IC on silicon substrate by low temperature wafer to wafer bonding technique
2008 / IEEE / 978-1-4244-2230-2
By: Lo, G.Q.; Rong Yang; Liao, E.B.; Yu, A.B.; Balasubramanian, N.; Li, H.Y.; Zhang, Q.X.; Tang, M.; Kwong, D.L.;
Integration of RF MEMS and CMOS IC on a Printed Circuit Board for a Compact RF System Application Based on Wafer Transfer
2008 / IEEE
By: Zhang, Q.X.; Dim Lee Kwong; Balasubramanian, N.; Guo Qiang Lo; Min Tang; Yu, A.B.; Liao, E.B.; Guo, L.H.; Li, H.Y.; Rong Yang;
Increasing distributed generation using automatic voltage reference setting technique
2008 / IEEE / 978-1-4244-1905-0
By: Li, H.Y.; Leite, H.;
Flexible High Performance Capacitor on Soft Elastic Material
2008 / IEEE / 978-1-4244-2117-6
By: Cheow, L.F.; Li, H.Y.; Lo, G.Q.; Chua, H.M.; Chua, T.T.;
Scheme Design and Analysis on Light Hydrocarbon Recovery System for Town Natural Gas
2009 / IEEE / 978-1-4244-2487-0
By: Li, H.Y.; Fan, Q.H.; Jia, L.X.; Cui, J.S.; Yin, Q.S.;
Automatic tool-path generation in 5-axis finish cut with multiple cutters
2009 / IEEE / 978-1-4244-3808-2
By: Zhang, Y.F.; Li, H.Y.;
Development of through silicon via (TSV) interposer technology for large die (21�1mm) fine-pitch Cu/low-k FCBGA package
2009 / IEEE / 978-1-4244-4475-5
By: Selvanayagam, C.S.; Ranganathan, N.; Lau, J.H.; Chai, T.C.; Zhang, X.; Vath, C.J.; Doricko, J.; Jiangyan Sun; Kripesh, V.; Biswas, K.; Liao, E.B.; Li, H.Y.; Wai, E.; Vempati, S.R.; Ong, Y.Y.; Tang, G.Y.; Pinjala, D.; Shiguo Liu;
Study on steering power balance simulation for hydrostatic drive tracked vehicle
2009 / IEEE / 978-1-4244-3503-6
By: Li, H.Y.; Biao Ma; Lei Yang; Chen, B.R.;
Vacuum plasma fast aging with self-adjusted effect for SCFE under high current electron beam
2009 / IEEE / 978-1-4244-3587-6
By: Li, H.Y.; Ding, Y.G.; Ju, Z.M.; Wang, D.A.; Lv, Q.N.; Xia, S.H.; Liu, G.Y.;
Voltage sags pattern recognition technique for fault section identification in distribution networks
2009 / IEEE / 978-1-4244-2234-0
By: Mokhlis, H.; Li, H.Y.; Khalid, A.R.;
Scheme Design and Analysis on Biogas Liquefaction System
2009 / IEEE / 978-0-7695-3819-8
By: Fan, Q.H.; Jia, L.X.; Cui, J.S.; Yin, Q.S.; Li, H.Y.;
Numerical Simulation and Optimization of Small- Scale LNG Plant for Skid Mounted
2010 / IEEE / 978-1-4244-4812-8
By: Fan, Q.H.; Ying, Q.S.; Li, H.Y.; Huang, Y.D.; Du, H.P.; Jia, L.X.;
Research and Adaptability Analysis on Acid Gas Removing Technology in Floating LNG Plant
2010 / IEEE / 978-1-4244-4812-8
By: Du, H.P.; Li, H.Y.; Fan, Q.H.; Jia, L.X.; Ji, Z.M.; Yin, Q.S.; Liu, L.; Cui, J.S.;
Characterization and management of wafer stress for various pattern densities in 3D integration technology
2010 / IEEE / 978-1-4244-6412-8
By: Chua, T.T.; Pang, X.F.; Che, F.X.; Lee, W.S.; Liao, E.B.; Li, H.Y.;
3D interconnection process development and integration with low stress TSV
2010 / IEEE / 978-1-4244-6412-8
By: Khong, C.H.; Li, H.Y.; Ho, S.W.; Chua, T.T.; Toh, C.H.; Nathapong, S.; Liao, E.B.; Kriangsak, S.L.; Ng, C.; Pang, X.F.; Lim, L.S.; Lee, W.S.; Chew, S.P.;
Fast electroplating TSV process development for the via-last approach
2010 / IEEE / 978-1-4244-6412-8
By: Yu, X.X.; Yu, H.; Pang, X.F.; Liao, E.; Li, H.Y.; Sun, J.Y.;
Stochastic simulation of three dimensional variation of soil salinity in a paddy rice soil
2010 / IEEE / 978-1-889335-42-1
By: Li, H.Y.;
Fine pitch low temperature RDL damascene process development for TSV integration
2010 / IEEE / 978-1-4244-8562-8
By: Li, H.Y.; Gao, S.; Teo, K.H.; Khan, N.; Pang, X.F.; Lee, W.S.; Li, H.B.; Ong, L.G.;
Fabrication and characterization of bump-less Cu-Cu bonding by wafer-on-wafer stacking for 3D IC
2010 / IEEE / 978-1-4244-8562-8
By: Lo, G.Q.; Lim, D.F.; Li, H.Y.; Peng, L.; Tan, C.S.; Kwong, D.L.;
Achieving Stable Through-Silicon Via (TSV) Capacitance with Oxide Fixed Charge
2011 / IEEE
By: Li, H.Y.; Zhang, L.; Tan, C.S.; Gao, S.;
Thermal reliability of fine pitch Cu-Cu bonding with self assembled monolayer (SAM) passivation for Wafer-on-Wafer 3D-Stacking
2011 / IEEE / 978-1-61284-498-5
By: Gao, S.; Lim, D.F.; Li, H.Y.; Peng, L.; Tan, C.S.;
Wafer level warpage modeling methodology and characterization of TSV wafers
2011 / IEEE / 978-1-61284-498-5
By: Li, H.Y.; Che, F.X.; Teo, K.H.; Gao, S.; Xiaowu Zhang;

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