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Author: Jung, W.S.
A novel Al-reflow process using surface modification by the ECR plasma treatment and its application to the 256 Mbit DRAM1994 / IEEE / 0-7803-2111-1
By: Reynolds, R.; Kim, Y.K.; Lee, M.Y.; Ahn, S.T.; Park, S.H.; Park, I.S.; Choi, G.H.; Jung, W.S.; Wee, Y.J.; Lee, S.I.; Park, C.S.;
Effects of NO/NO/sub 2/ ratio on NO/sub x/ removal efficiency in plasma assisted ammonia SCR hybrid process2003 / IEEE / 0-7803-7911-X
By: Namkung, W.; Cho, M.H.; Kil, Y.M.; Jung, W.S.; Choi, Y.R.; Lee, Y.H.;