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Author: Dayong Gui

Results

Improving the thermal conductivity of epoxy resins with mesogenic units for electronic packaging
2011 / IEEE / 978-1-4577-1769-7
By: Jianhong Liu; Dayong Gui; Jingfeng Hao; Wentao Zeng;
Synthesis and characterization of liquid silicone rubber for LED packaging
2011 / IEEE / 978-1-4577-1769-7
By: Wentao Zeng; Jingfeng Hao; Jianhong Liu; Dayong Gui;
Preparation, liquid crystal property and thermodynamic property of Amine-terminated polyesterimide, as modifiers for epoxy resin
2011 / IEEE / 978-1-4577-1769-7
By: Wentao Zeng; Xin Miao; Deqin Si; Jingfeng Hao; Dayong Gui; Jianhong Liu;
Study on Epoxy Molding Compounds Modified by Novel Phosphorus-Containing Flame Retardant and OMMT
2006 / IEEE / 1-4244-0619-6
By: Dayong Gui; Juhua Mao;
Simulation Calculation of Mechanical Performance of Particle Filled Electronic Packaging Polymer
2006 / IEEE / 1-4244-0619-6
By: Jianhong Liu; Deyu Tian; Juhua Mao; Dayong Gui;
A core-shell structure viscoelastic model of particulate-filled electronic packaging polymers
2009 / IEEE / 978-1-4244-4658-2
By: Xin Miao; Bo Chen; Jianhong Liu; Dayong Gui; Deyu Tian; Guangfu Zeng;
Study on the surface modification of silica particle and its filled epoxy resin
2010 / IEEE / 978-1-4244-8142-2
By: Dayong Gui; Jianhong Liu; Guangfu Zeng; Xin Miao; Wentao Zeng; Bo Chen;
Improving the humidity resistance of electronic packaging materials by micro-nano hierarchical structured silica
2010 / IEEE / 978-1-4244-8142-2
By: Jingfeng Hao; Xin Miao; Dayong Gui; Guangfu Zeng; Jianhong Liu;
Study on preparation and properties of epoxy resin modified by amine-terminated polyimide as electronic packaging materials
2010 / IEEE / 978-1-4244-8142-2
By: Jianhong Liu; Guangfu Zeng; Dayong Gui; Xin Miao;

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